Method for machining tiny grooves through ultrasonic grinding

Abstract

The invention provides a method for machining tiny grooves through ultrasonic grinding. The method comprises the steps that firstly, grinding balls and a workpiece to be machined are all located in grinding fluid; secondly, after an ultrasonic generator emits out ultrasonic waves, a transducer converts the electric oscillation of the audio frequency of the input ultrasonic waves into mechanical vibration; thirdly, the ultrasonic vibration is transmitted to a vibrating bar to make the vibrating bar to vibrate up and down, vibration produced by the vibrating bar is transmitted to a vibrating plate, and the vibrating plate transmits vibration to the grinding balls on a locating plate so that vibration produced by the grinding balls can rapidly impact abrasive particles in the grinding fluid, and then the required grooves can be formed in the workpiece. By means of the method, the machining accuracy and the machining efficiency are both considered, the machining consistency is good, and the control mode of a machining device is simplified.

Description

technical field [0001] The invention relates to the field of die processing, in particular to a high-precision die processing method. Background technique [0002] Most of the function of the die is used for forming. The die is processed according to the shape of the required product. It is used to drop the shape of the product or punch down the waste in the middle of the product. It is very important in precision equipment and precision machining. The position of the die, the precision of the die affects the performance of some parts produced by the die. [0003] The processing method of the die has an important influence on the precision of the die. At present, there are some corresponding methods for processing the die at home and abroad. The commonly used methods for processing the die include lathe processing (grinding), heat treatment processing, electrolytic processing, electrolytic processing, and electrolytic processing. Spark processing, drill bits of a certain sh...

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the shortcomings of existing die processing methods that cannot take into account both precision and low processing efficiency, poor processing consistency, and complicated processing devices and controls when processing tiny dies, the present invention provides a method that can take into account processing accuracy, processing efficiency, and processing consistency. Ultrasonic grinding micro-die processing method with better control mode and simplified processing device

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