IGBT module steady state temperature calculating method

A calculation method and steady-state technology, which is applied in the field of steady-state temperature calculation of IGBT modules, can solve problems such as error-prone, difficult to obtain model parameters, and difficult to obtain parameters, so as to improve work efficiency, avoid huge calculation workload, and avoid time consuming serious effect

Active Publication Date: 2015-06-24
STATE GRID CORP OF CHINA +2
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Problems solved by technology

[0006] (1) These methods focus on the trend of temperature changes, require complex calculation conditions and the parameters are not easy to obtain;
[0007] (2) The value and arrangement of heat capacity parameters have a great influence on the calculation accuracy, which is prone to errors;
[0008] (3) It is difficult to obtain model parameters, which cannot be obtained by ordinary users;
[0009] (4) The model calculation workload is huge and takes a long time

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  • IGBT module steady state temperature calculating method
  • IGBT module steady state temperature calculating method
  • IGBT module steady state temperature calculating method

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Embodiment Construction

[0046] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0047] In order to thoroughly understand the embodiments of the present invention, the detailed structure will be set forth in the following description. Obviously, the practice of the embodiments of the invention is not limited to specific details familiar to those skilled in the art. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.

[0048] The present invention obtains the loss of all chips in the IGBT module by calculating the on-state loss, off-state loss and switching loss of the IGBT chip and the diode chip in the IGBT module respectively, and uses the connection topology and physical thermal resistance of each component in the heat propagation path of the IGBT module to establish The therma...

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Abstract

The invention discloses an IGBT module steady state temperature calculating method. The IGBT module steady state temperature calculating method comprises the following steps that an IGBT module loss is calculated; an IGBT module thermal characteristic parameter is input; an IGBT module radiating system thermal way model is established, and the thermal way model comprises an IGBT module, thermal conducting contact materials and a radiator; the IGBT module temperature is confirmed. According to the IGBT module steady state temperature calculating method, an equivalent thermal way model generated by the end thermal conducting characteristic mathematical approximation method in the prior art is avoided, the steady state calculation accuracy is guaranteed, and meanwhile the distortion and the error which are caused by non-physical thermal resistance and thermal capacity are avoided; the defects that a field domain calculation model is huge in calculation workload and severe in time consumption are avoided, and the working efficiency of the system design based on the IGBT module is improved.

Description

technical field [0001] The invention relates to a steady-state temperature calculation method, in particular to a steady-state temperature calculation method of an IGBT module. Background technique [0002] An insulated gate bipolar transistor (Insulated Gate Bipolar Transistor, IGBT) is a power electronic device that can be turned on and off by a control signal. An IGBT has three terminals: a gate terminal (G) and two load terminals emitter (E), collector (C). By applying an appropriate voltage between the gate and the emitter, the IGBT can control the current flow in one direction, that is, turn on and turn off. Since the IGBT device cannot withstand back pressure, in industrial applications, a freewheeling diode is generally connected in parallel between the two load terminals of the IGBT device and packaged together to form an IGBT module. IGBT has the characteristics of high input impedance, low driving power, simple control circuit, fast speed and high operating freq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 李泓志赵岩贺之渊季兰兰高凯韩子娇李铁
Owner STATE GRID CORP OF CHINA
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