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OLED device and encapsulating method thereof

A packaging method and device technology, which is applied in the manufacture of semiconductor devices, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of high cost and difficult realization of glass frit packaging methods, and achieve the effect of reducing process difficulty and cost

Active Publication Date: 2015-06-24
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that the glass frit encapsulation method for OLED devices in the prior art is difficult to realize and the cost is high, thereby providing an OLED device encapsulation method that is easy to implement and effectively reduces costs and the OLED device obtained by the method

Method used

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  • OLED device and encapsulating method thereof
  • OLED device and encapsulating method thereof
  • OLED device and encapsulating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] This embodiment provides a packaging method for an OLED device, such as image 3 shown, including the following steps:

[0046] S1: setting a plurality of sealing frames 403 with a height H1 on the packaging cover 400; preparing a support 401 with a height H2 inside the sealing frames 403 on the inner surface of the packaging cover 400.

[0047] S2: the packaging cover plate 400 is arranged on the OLED device, the sealing frame 403 is attached to the substrate 301 of the OLED device, and the support body 401 is in contact with the surface of the light emitting unit;

[0048] S3: Make the sealing frame 403 connect the packaging cover plate 400 and the substrate 301 of the OLED device, and complete the packaging. The above packaging method in this embodiment can ensure that when the packaging cover plate 400 is covered on the OLED device, the support body 401 and the The OLED device can be effectively contacted without generating too much pressure to cause damage to the...

Embodiment 2

[0061] On the basis of Example 1, in step S1 in this example, the glass frit used in the frit sealing frame includes V 2 o 5 ,P 2 o 5 , BaO, SiO 2 , B 2 o 3 、Al 2 o 3 , PbO, SnO, TeO 2 , MgO, CaO, ZnO, TiO 2 、WO 3 、 Bi 2 o 3 , Fe 2 o 3 , CuO, Sb 2 o 3 、Ru 2 O, Rb 2 O, any one or combination of lead borate glass, tin phosphate glass, vanadate glass and borosilicate. Wherein the size of the glass frit particles is greater than or equal to 0.1um and less than or equal to 10um. The above-mentioned glass frit can simultaneously meet various requirements such as packaging temperature, thermal expansion coefficient, thermal stability and chemical stability.

[0062] Further, in the step S12, the support body 401 is made of an organic polymer material, and the organic polymer is PI polyimide, epoxy resin, polyester, silicone resin, polycarbonate, aromatic Any one or a combination of heterocyclic polymers. The above-mentioned organic polymer materials all have cert...

Embodiment 3

[0064] On the basis of Embodiment 1 or Embodiment 2, the OLED device packaging method in this embodiment, the support body 401 in the step S12 is several pillars;

[0065] In the step S2, when the packaging cover plate 400 is placed on the OLED device, the contact point 701 between each pillar and the light emitting unit is located in the gap between two adjacent pixel subunits 305 place.

[0066]The pillars in this embodiment may be arranged in the same distribution manner as the pixel sub-units 305 , that is, there will be a contact point 701 in contact with the pillars between every two pixel sub-units 305 . It can also be set in such a way that there is a contact point 701 between every two pixel subunits 305 along the horizontal or vertical direction, such as Figure 7A and Figure 7C shown. This setting mode is simpler and more convenient for the preparation process. Or the setting method of the pillars adopts unequal intervals, such as Figure 7B and Figure 7D As...

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Abstract

The invention relates to an OLED device and an encapsulating method thereof. By reasonably setting the height of sealing frames, the height of supporting bodies and the height value of an OLED device light emitting unit, it can be guaranteed that when the OLED device is covered with an encapsulating cover plate, the supporting bodies can make effective contact with the OLED device but too much pressure cannot be generated to damage the OLED device. Besides, the encapsulating cover plate is of a single-layer structure, so difficulty and cost of the process that the supporting bodies are directly manufactured on the encapsulating cover plate can be greatly reduced compared with the process that the supporting bodies are manufactured on the OLED device of a multi-layer structure.

Description

technical field [0001] The invention relates to the field of flat display, in particular to a method for encapsulating a glass frit sealing an organic light-emitting display including a pillar structure. Background technique [0002] As a new generation of display devices, OLED (Organic Electroluminesence Display) devices have incomparable advantages over traditional displays, such as self-illumination, no need for backlight, ultra-thin and flexible displays, low driving voltage, and power saving. , fast response and so on. However, OLED devices are very sensitive to oxygen and moisture, and their performance will deteriorate and eventually fail when attacked by oxygen and moisture. Therefore, the encapsulation process has a great influence on the lifetime of the OLED device. At present, it is widely used to seal and protect OLED devices by glass frit encapsulation method. [0003] Existing glass frit encapsulation methods such as figure 1 As shown, a glass frit sealing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52
Inventor 彭兆基刘建立
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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