Bi-component condensed type organic silicon pouring sealant as well as preparation method and application thereof

A silicone potting, condensation-type technology, applied in the directions of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of increasing the amount of catalyst used, pores, and insufficient curing depth, so as to meet the waterproof requirements. Effect

Inactive Publication Date: 2015-07-01
深圳广恒威科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem with the two-component condensation type silicone potting compound is that the curing depth is not enough, and the amount of catalyst needs to be increased, resulting in the phenomenon of reduction after the product is completely cured and baked under airtight conditions, resulting in internal pores.

Method used

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  • Bi-component condensed type organic silicon pouring sealant as well as preparation method and application thereof
  • Bi-component condensed type organic silicon pouring sealant as well as preparation method and application thereof
  • Bi-component condensed type organic silicon pouring sealant as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0036] One embodiment of the invention includes:

[0037] A two-component condensation type silicone potting compound, including A component and B component;

[0038] The above component A contains the following raw materials in parts by weight: 350-500 parts of linear hydroxyl-terminated polydimethylsiloxane, 300-600 parts of filler, 50-150 parts of base glue, and 0.1-5 parts of deep-layer curing agent;

[0039] The above component B contains the following raw materials in parts by weight: 200-500 parts of crosslinking agent, 300-800 parts of plasticizer, 50-100 parts of coupling agent, and 0.5-2 parts of catalyst;

[0040] The weight ratio of the above-mentioned component A to the above-mentioned component B is 100:5˜100:20.

[0041] The A component and the B component in the above two-component condensation type silicone potting compound undergo a crosslinking reaction at room temperature, vulcanize into a rubber elastic body, and realize the potting function.

[0042] Th...

Embodiment 1

[0083] A glue component:

[0084]

[0085] Add the basic compound, base glue, flame retardant and carbon black into the dispersing tank according to the designed ratio, disperse evenly at high speed, cool to 40-50°C, add deep curing agent, stir evenly at low speed, vacuumize, and then pack.

[0086] B glue components:

[0087]

[0088] Mix the cross-linking agent, coupling agent, catalyst and plasticizer evenly, remove the small molecular compounds, leave it for 24 hours, and then pack it.

Embodiment 2

[0090] A glue component:

[0091]

[0092] Add the basic compound, base glue, thermal conductive powder and carbon black into the dispersion cylinder according to the designed ratio, disperse evenly at high speed, cool to 40-50°C, add deep curing agent, stir evenly at low speed, vacuumize, and then pack.

[0093] B glue components:

[0094]

[0095] Mix the cross-linking agent, coupling agent, catalyst and plasticizer evenly, remove the small molecular compounds, leave it for 24 hours, and then pack it.

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Abstract

The invention discloses a bi-component condensed type organic silicon pouring sealant as well as a preparation method and an application thereof. The bi-component condensed type organic silicon pouring sealant consists of a component A and a component B, wherein the component A comprises the following raw materials in parts by weight: 350-500 parts of linear hydroxyl-terminated polydimethylsiloxane, 300-600 parts of filler, 50-150 parts of base gum and 0.1-5 parts of a deep curing agent; the component B comprises the following raw materials in parts by weight: 200-500 parts of a cross linker, 300-800 parts of a plasticizer, 50-100 parts of a coupling agent and 0.5-2 parts of a catalyst; and the weight ratio of the component A to the component B is (100:5) to (100:20). Under an airtight condition, the sealant, which is aged for 30d at 150 DEG C, is free from the abnormal phenomenons of peeling off, pores, failure, reduction and the like, and the sealant can completely meet the requirements of an LED driving power supply or a waterproof power supply on waterproofing and binding properties.

Description

technical field [0001] The invention relates to the technical field of potting glue, in particular to a two-component condensation type silicone potting glue which can be used for potting LED drive power or waterproof power supply, and its preparation method and application. Background technique [0002] At present, silicone, epoxy resin and polyurethane are the three most commonly used potting materials for LED (Light Emitting Diode, light emitting diode) driving power. Among them, the characteristics of epoxy resin potting are: small shrinkage, no by-products, excellent electrical insulation performance, but limited by the molecular structure itself, poor toughness, low heat resistance, and poor repairability. The characteristics of polyurethane potting glue are: it has excellent water resistance, heat resistance and cold resistance, but its performance is limited, it can be used continuously at 130 °C, and can only be used intermittently at 150 °C, and the polyurethane ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J11/04C09J11/06H01L33/56
Inventor 艾瑞克·C·王毛志平
Owner 深圳广恒威科技有限公司
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