Thermal coupling structure and realization method for ultra-long line array detector and single-point cold source

Abstract

The invention discloses a high-temperature-uniformity coupling structure and realization method for an ultra-long line array detector and a single-point cold source. The high-temperature-uniformity coupling structure is mainly composed of an ultra-long line array infrared detector, a heat isolating gasket, an auxiliary fixing baseplate, a hollow conical supporting column, a tree-shaped low-temperature flexible cold chain, a low-temperature thermal layer of a three-layer stacked structure of a tooth-shaped meshing structure, and the single-point cold source. By a temperature uniformizing method combining the tree-shaped low-temperature flexible cold chain and the low-temperature thermal layer of the three-layer stacked structure, cold quantity of the single-point cold source is uniformly led onto the ultra-long line array infrared detector to acquire high temperature uniformity while three-dimensional thermal contraction in the process of cooling after the cold source is connected with the ultra-long line array infrared detector is eliminated. The high-temperature-uniformity coupling structure is of a bridge-type mechanical supporting structure, thereby being high in environment adaptability. The high-temperature-uniformity coupling structure is simple in structure, convenient to operate, high in maintainability and interchangeability and suitable for other thermal coupling occasions of ultra-large cold platforms and the single-point cold source.

Description

technical field [0001] The present invention relates to ultra-long line array infrared detector packaging technology, specifically refers to a thermal coupling structure and realization method of an ultra-long line array detector and a single-point cold source, which is suitable for Dewar packaging of an ultra-long line array infrared focal plane detector chip , It is also suitable for thermal coupling occasions of other super large cold platforms and single-point cold sources. Background technique [0002] High spatial resolution infrared remote sensing instrument is the core component of infrared YX, search and tracking system. There are generally two ways to improve the spatial resolution. One is to improve the photoelectric performance of infrared detectors and improve detection sensitivity to obtain more information; the other is to increase the number of infrared sensitive elements, that is, remote sensing instruments at the same height and the same swath , the more s...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high temperature uniformity coupling structure and implementation method of an ultra-long line array detector and a single-point cold source, so as to solve the problem of high temperature uniformity of the super-large size in the Dewar package of the spliced ​​ultra-long line array infrared detector chip. Questions of sex and mechanical support

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