Storage card for surface-mounted component, feeder and automatic chip mounter

A surface mount and memory card technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of small printed circuit boards and unsuitable packaging of small-sized chip components

Inactive Publication Date: 2015-07-01
弗兰克·魏
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since each recessed component magazine in the carrier tape can only accommodate one chip component, and each chip component requires a correspondingly sized recessed component magazine, chip component manufacturers must store a large number of chips. Carrier tapes of different specifications are used to pack chip components of different specifications; and the carrier tape itself has the characteristics of large volume, light weight, and one-time use, which causes the transportation and storage of chip component manufacturers and chip component users. and recycling burden
[0004] In addition, there are also some problems when using traditional carrier tapes for chip component assembly: With ...

Method used

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  • Storage card for surface-mounted component, feeder and automatic chip mounter
  • Storage card for surface-mounted component, feeder and automatic chip mounter
  • Storage card for surface-mounted component, feeder and automatic chip mounter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Such as Figure 7 to Figure 9 As shown, the card 60 is made of semi-rigid hard material like plastic sheet, paper sheet, etc., so as to keep the card 60 in the shape of a cuboid. The volume of the card 60 is 75*50*4mm, and it is used to place the chip component 1 of model 1206, and the volume of the chip component 1 is 3*1.5*1mm. The card 60 is provided with 37*21 component bins 57 vertically penetrating the front surface 51 and the rear surface 52 of the card 60, and a plurality of component bins 57 are regularly distributed with 21 per row and 37 per column, and each component The volume of the bin 57 is 1.7*1.1*4 mm, that is, the cross-section of the component bin 57 is slightly larger than the cross-section of the chip components 1 accommodated therein. A component bin 57 accommodates a chip component 1, and when the chip component 1 is loaded in the component bin 57 along its length direction, the chip component 1 and the component bin 57 are clearance fit, and th...

Embodiment 2

[0069] Such as Figure 10 to Figure 12 As shown, the card 70 is made of elastic materials such as rubber and sponge, and can also be made of semi-rigid materials such as foamed polyester to keep the card 70 in the shape of a cuboid. The volume of the card 70 is 100*50*4mm, and it is used to place the 0603 chip component 1, and the volume of the chip component 1 is 1.5*0.75*0.45mm. The card 70 is provided with 21*67 component bins 57 vertically penetrating the front surface 51 and the rear surface 52 of the card 70, and a plurality of component bins 57 are regularly distributed with 21 per row and 67 per column, and each component The volume of the bin 57 is 0.7*0.4*4mm, that is, the cross-section of the component bin 57 is slightly smaller than the cross-section of the chip components 1 accommodated therein. When the chip component 1 is loaded into the component bin 57 along its length direction under the action of external force, the chip component 1 and the component bin 57...

Embodiment 3

[0075] Such as Figure 14 As shown, the card 80 is made of hard materials such as plastic sheets and hard paper sheets, which can keep the card 80 in the shape of a cuboid, and can make the card 80 slightly deform under the action of external force, so that the chip component 1 It is fixed in the card 80 to prevent friction and collision between two adjacent chip elements 1; when the external force is removed, the card 80 can still return to its original shape; or, the card 80 is made of elastic material similar to rubber or sponge material, and a splint 510 made of hard material is pasted on the front surface 51 and the rear surface 52 of the card 80 to maintain the cuboid shape of the memory card. Due to the strong rigidity of the splint 510, when an external force is applied, the card 80 will Figure 16 or Figure 18 deform in that way to fix the chip component 1 in the card 80 . Conversely, cards can be made such as Figure 16 or Figure 18 In that shape, an external ...

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Abstract

The invention discloses a storage card for a surface-mounted component, a feeder and an automatic chip mounter. The storage card for the surface-mounted component provided by the invention includes a rectangular card having a front surface, a rear surface, a left surface, a right surface, an upper surface and a lower surface, wherein the area of each of the front and rear surfaces is more than that of each of the other four surfaces; the card is provided with a plurality of component bins penetrating through the card and used for accommodating chip components; the cross section of the component bin is polygonal, circular or oval in shape; when the cross section of the component bin is polygonal in shape, the longest diagonal line of the cross section of the component bin is smaller than the body diagonals of the chip components; when the cross section of the component bin is circular or oval in shape, the maximal diameter of the cross section of the component bin is smaller than the body diagonals of the chip components. The storage card is simple in structure, high in package density, compact in volume, low in costs, easy to put in and take out the chip components, and good in popularization prospect.

Description

technical field [0001] The invention relates to an automatic assembling system for chip components, in particular to a memory card, a feeder and an automatic chip mounter for surface chip components. Background technique [0002] The structure of SMD electronic components (hereinafter referred to as "chip components") applied to surface mount mounting is as follows: figure 1 and figure 2 As shown, the chip component 1 usually includes a regular component body 101 and a solderable terminal 102 located at the end of the component body 101 or other parts of the component body 101, through which the chip component can be directly pasted. And welding on the surface of the printed circuit board, not only saves the electrode lead, but also saves the use area of ​​the printed circuit board. At present, such chip components are packaged by tape, that is, the chip components are loaded into a long carrier tape, the carrier tape is wound into a roll, and the chip components in the c...

Claims

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Application Information

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IPC IPC(8): H05K13/02H05K13/04
Inventor 弗兰克·魏
Owner 弗兰克·魏
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