Production process of electrolytic copper foil with low warping degree
A technology of electrolytic copper foil and production process, which is applied in the direction of electrolysis, electroforming, etc., can solve the problems of copper clad laminate and printed circuit board production performance and production efficiency, achieve good prospects and application value, and reduce stress.
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Embodiment 1
[0010] A production process of low-warpage electrolytic copper foil, including the steps of dissolving copper to prepare liquid and electrolytic raw foil, and Cu in the copper sulfate electrolyte obtained in the step of dissolving copper to prepare liquid 2+ Concentration 85g / L, H 2 SO 4 Concentration 105g / L, hydroxyethyl cellulose 15g / L, gelatin 20g / L, sodium polydithiodipropanesulfonate 20g / L, HCl 10g / L; The density is 60A / dm 2 .
[0011] For the electrolytic copper foil with a thickness of 12 μm prepared in this embodiment, a sample of 200 mm×200 mm was selected, and the maximum warpage height of the four corners was tested to be 9 mm.
Embodiment 2
[0013] A production process of low-warpage electrolytic copper foil, including the steps of dissolving copper to prepare liquid and electrolytic raw foil, and Cu in the copper sulfate electrolyte obtained in the step of dissolving copper to prepare liquid 2+ Concentration 70g / L, H 2 SO 4 Concentration 90g / L, hydroxyethyl cellulose 3g / L, gelatin 2g / L, polyethylene glycol-4000 5g / L, acetamide 1g / L; the process conditions of the electrolytic foil production step are temperature 45°C, current density 45A / dm 2 .
[0014] For the electrolytic copper foil with a thickness of 12 μm prepared in this example, a sample of 200 mm×200 mm was selected, and the maximum warpage height of the four corners was tested to be 8 mm.
Embodiment 3
[0016] A production process of low-warpage electrolytic copper foil, including the steps of dissolving copper to prepare liquid and electrolytic raw foil, and Cu in the copper sulfate electrolyte obtained in the step of dissolving copper to prepare liquid 2+ Concentration 95g / L, H 2 SO 4 Concentration 120g / L, hydroxyethyl cellulose 30g / L, gelatin 35g / L, thiourea 35g / L, sodium saccharin 20g / L; the process conditions of the electrolytic foil production step are temperature at 55°C and current density at 70A / dm 2 .
[0017] For the electrolytic copper foil with a thickness of 12 μm prepared in this example, a sample of 200 mm×200 mm was selected, and the maximum warpage height of the four corners was tested to be 3 mm.
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