Production process of electrolytic copper foil with low warping degree

A technology of electrolytic copper foil and production process, which is applied in the direction of electrolysis, electroforming, etc., can solve the problems of copper clad laminate and printed circuit board production performance and production efficiency, achieve good prospects and application value, and reduce stress.

Inactive Publication Date: 2015-07-08
LINGBAO WASON COPPER FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This problem has a great impact on the production performance and pro

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0010] A production process of low-warpage electrolytic copper foil, including the steps of dissolving copper to prepare liquid and electrolytic raw foil, and Cu in the copper sulfate electrolyte obtained in the step of dissolving copper to prepare liquid 2+ Concentration 85g / L, H 2 SO 4 Concentration 105g / L, hydroxyethyl cellulose 15g / L, gelatin 20g / L, sodium polydithiodipropanesulfonate 20g / L, HCl 10g / L; The density is 60A / dm 2 .

[0011] For the electrolytic copper foil with a thickness of 12 μm prepared in this embodiment, a sample of 200 mm×200 mm was selected, and the maximum warpage height of the four corners was tested to be 9 mm.

Embodiment 2

[0013] A production process of low-warpage electrolytic copper foil, including the steps of dissolving copper to prepare liquid and electrolytic raw foil, and Cu in the copper sulfate electrolyte obtained in the step of dissolving copper to prepare liquid 2+ Concentration 70g / L, H 2 SO 4 Concentration 90g / L, hydroxyethyl cellulose 3g / L, gelatin 2g / L, polyethylene glycol-4000 5g / L, acetamide 1g / L; the process conditions of the electrolytic foil production step are temperature 45°C, current density 45A / dm 2 .

[0014] For the electrolytic copper foil with a thickness of 12 μm prepared in this example, a sample of 200 mm×200 mm was selected, and the maximum warpage height of the four corners was tested to be 8 mm.

Embodiment 3

[0016] A production process of low-warpage electrolytic copper foil, including the steps of dissolving copper to prepare liquid and electrolytic raw foil, and Cu in the copper sulfate electrolyte obtained in the step of dissolving copper to prepare liquid 2+ Concentration 95g / L, H 2 SO 4 Concentration 120g / L, hydroxyethyl cellulose 30g / L, gelatin 35g / L, thiourea 35g / L, sodium saccharin 20g / L; the process conditions of the electrolytic foil production step are temperature at 55°C and current density at 70A / dm 2 .

[0017] For the electrolytic copper foil with a thickness of 12 μm prepared in this example, a sample of 200 mm×200 mm was selected, and the maximum warpage height of the four corners was tested to be 3 mm.

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PUM

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Abstract

The invention belongs to a production process of an electrolytic copper foil with a low warping degree. The production process comprises a step of dissolving copper to prepare liquid and a step of producing a foil by electrolysis. In the step of dissolving copper to prepare the liquid, a copper sulfate electrolyte contains 70-95g/L Cu<2+>, 90-120g/L H2SO4, 3-30g/L hydroxyethyl cellulose, 2-35g/L gelatin, a 5-35g/L additive A and a 1-20g/L additive B. In the step of producing a foil by electrolysis, the process conditions are as follows: the temperature is 45-55 DEG C, the current density is 45-70A/dm<2>; the additive A is one or more of polyethylene glycol, sodium dithiodipropane sulfonate and thiourea; the additive B is one or more of amide, HCl and saccharin sodium. By adopting the production process provided by the invention, the stress generated in the existing production process of a high-precision electrolytic copper foil can be effectively reduced, so that the production process is of significance in solving the problem that the warping degree affects the performance of the copper foil.

Description

technical field [0001] The invention belongs to the technical field of electrolytic copper foil production technology, and in particular relates to a production technology of low warpage electrolytic copper foil. Background technique [0002] With the rapid development of the modern electronics industry, high-quality electrolytic copper foil materials with good stability are becoming more and more important. At present, in the production process of electrolytic copper foil, due to factors such as the configuration of additives, the surface quality of the cathode roll, the stress of the copper foil peeling off on the cathode roll, and the inclusions in the surface treatment process, the warping problem of copper foil is a problem for many production problems faced by manufacturers. This problem has a great impact on the manufacturing performance and production efficiency of copper clad laminates and printed circuit boards. Contents of the invention [0003] The object of ...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38
Inventor 樊斌锋王建智张欣柴云韩树华姚于希何铁帅
Owner LINGBAO WASON COPPER FOIL
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