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A three-dimensional packaging structure of microwave circuits with circuits arranged on the front and back sides of an ltcc substrate

A microwave circuit and three-dimensional packaging technology, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve the problems of complex assembly process and large packaging volume, and achieve the effects of simplified assembly process, large contact area, and small volume

Inactive Publication Date: 2017-11-14
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the defects of complex assembly process and large packaging volume in the existing plug-in type and substrate stacking type, the present invention provides a three-dimensional packaging structure of microwave circuits with LTCC substrate stacking. The packaging structure has simple assembly process and is suitable for Low bit accuracy requirements, high mechanical strength

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  • A three-dimensional packaging structure of microwave circuits with circuits arranged on the front and back sides of an ltcc substrate

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0020] The present invention includes:

[0021] A LTCC (low temperature co-fired ceramic) substrate 1 with a thickness of about 2mm. The LTCC substrate 1 is laminated with several layers (5-30 layers) of ferro A6s material with a thickness of 0.094mm (single layer thickness) and then heated at 850°C-900°C ℃ low temperature co-firing, the upper and lower surfaces of the LTCC substrate 1 form a microwave circuit with certain functions through a micro-assembly process, the through hole 4 running through the LTCC substrate 1 is filled with metal, and the function of the through hole 4 filled with metal is for LTCC The circuit connection of the microwave board on the upper and lower surfaces (front and back) of the substrate. The lower surface of the LTCC substrate is...

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Abstract

The invention discloses a microwave circuit three-dimensional packaging structure in which circuits are arranged on the front and back sides of an LTCC substrate, including an LTCC substrate, a supporting aluminum plate and an aluminum cavity, the upper surface of the supporting aluminum plate is bonded to the lower surface of the LTCC substrate, and the lower surface of the supporting aluminum plate is bonded to In the cavity of the aluminum cavity, the supporting aluminum plate is an aluminum frame hollowed out in the middle. The invention has the advantages of simple assembling process, low alignment accuracy requirement, high mechanical strength and small packaging volume.

Description

technical field [0001] The invention belongs to the technical field of miniaturized packaging of microwave or millimeter wave circuits and systems, and in particular relates to a microwave circuit three-dimensional packaging structure in which circuits are arranged on the front and back sides of an LTCC substrate. Background technique [0002] Microwave microassembly technology (MMCM) is the key technology to realize the miniaturization, light weight, high performance and high reliability of the electronic machine. The LTCC (low temperature co-fired ceramic) substrate has good microwave signal transmission performance and can realize passive devices in the substrate. Embedded, therefore LTCC substrate-based and micro-assembly technologies are an important way to achieve miniaturization of microwave modules and systems. In order to further reduce the volume and increase the assembly density, the micro-assembly technology of three-dimensional packaging (3D-MMCM) has become a h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/14H01L23/02H01L23/498
Inventor 黄学骄吕立明黄祥唐艺伦凌源王平黄维
Owner INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS