Hot melt adhesive composition and preparation method thereof, hot melt adhesive thermal conductive sheet and preparation method thereof

Abstract

The invention provides a hot melt adhesive composition and a preparation method thereof and further provides a hot melt adhesive heat-conducting strip and a preparation method thereof based on the hot melt adhesive composition. The hot melt adhesive composition at least comprises, by weight, 6 to 9 parts of thermoplastic resin with a softening point of 85 to 120 DEG C, 0.40 to 0.60 parts of a tackifier and 73 to 110 parts of a heat-conducting particle. Since the softening point of the thermoplastic resin is high in temperature, the softening point of the prepared hot melt adhesive composition is also high in temperature; and thus, the heat-conducting strip prepared from the hot melt adhesive composition does not flow or deform at a normal usage temperature. The disadvantages of easy flowing and deformation of heat-conducting strips in the prior art are overcome. Moreover, the heat-conducting strip provided by the invention has low thickness, so the heat conduction performance of the heat-conducting strip is improved.

Description

technical field [0001] The invention relates to the field of interface materials for electronic components, in particular to a hot melt adhesive composition and a preparation method thereof, as well as a heat conduction sheet made of the hot melt adhesive composition and a preparation method of the heat conduction sheet. Background technique [0002] Among the types of thermal interface materials, phase change materials are more and more favored by professional designers as a material with superior characteristics such as high heat transfer efficiency and long service life. Specifically, the phase-change interface material has very low thermal resistance and has a much longer lifespan than silicone grease, and can die-cut products that meet the diverse needs of users better than silicon mud products. A characteristic of phase change materials is that when the ambient temperature reaches the phase transition point, the material begins to soften and begins to flow. For the ge...

AI Technical Summary

Problems solved by technology

For the general phase change material used as the interface material of electronic components, its phase change point should not be too high, generally around 50°C. This characteristic is a fatal flaw in the application process of this material, especially at the phase change interface. During the ocean transportation of materials, the ambient temperature often exceeds its phase transition point, which causes the phase transition interface material to flow and deform before it reaches the user's hands.

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