Surface treatment method of copper foil and copper foil surface-treated by the method
一种表面处理、铜箔的技术，应用在电气元件、印刷电路制造、印刷电路等方向，能够解决损失增加、铜箔制造效率降低、降低铜箔制造效率等问题
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Embodiment 1
[0042] [Example 1] Manufacture of copper foil laminate
[0043] 1) Copper foil surface treatment
[0044] Put the rolled copper foil with a thickness of 200 μm into the degreasing solution (NaOH with a concentration of 5g / l), dip it at 40-50°C for 10 seconds and degrease, then pickle and clean the surface by a method known in the art (pretreatment ). The washed rolled copper foil is thrown into an electrolytic solution containing copper (Cu) and roughened to form nodules on the surface. At this time, conditions of the electrolytic solution used for forming copper nuclei and the electrolytic solution used for growing copper nuclei are shown in Table 1 below.
[0045] Next, in order to form an alloy plating layer on the surface of the nodule formed on the copper foil, electroplating was performed using the plating solution (using sulfuric acid as the electrolytic solution) and plating conditions in Table 2 below.
[0046] Next, immerse the copper foil after the alloy plating ...
Embodiment 2～11
[0053] When forming an alloy plating layer, the copper foil laminated body was manufactured through the same process as Example 1 mentioned above except applying the plating solution (using sulfuric acid as electrolytic solution) and plating conditions of the following Table 2.
experiment example
[0064] The physical properties of the copper foil laminates produced in Examples 1 to 11 and Comparative Examples 1 to 10 were evaluated by the following methods, and the results are shown in Tables 3 and 4 below (the evaluation was "good ( Good)").
[0065] 1. Adhesive strength A: Cut the copper foil laminate into a width of 2 cm, fix it with tape (acid-resistant), etch it in an etching solution (sulfuric acid + hydrogen peroxide), and use a universal testing machine (UTM) to make a test piece ) to measure the 90-degree adhesive strength (4.00 kgf / cm or more was evaluated as "good").
[0066] 2. Adhesive strength B: Baking the test piece made to measure the above-mentioned adhesive strength A in an oven (Oven) at 180°C for 24 hours, and then using a universal testing machine (UTM) to measure the 90-degree adhesive strength .
[0067] 3. Heat resistance: Set the temperature of the solder bath to 288°C. After that, if the temperature of the solder bath reaches the set tempera...
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