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Film structure, testing method thereof, display substrate and testing method and production method thereof

一种显示基板、膜层结构的技术,应用在测量装置、电容测量、测量电变量等方向,能够解决待测膜层厚度值不够精确等问题

Inactive Publication Date: 2015-07-29
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The embodiment of the present invention provides a film layer structure, a test method, a display substrate, a test method, and a preparation method, so as to solve the problem in the prior art that the thickness value of the film layer to be measured is not accurate enough

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  • Film structure, testing method thereof, display substrate and testing method and production method thereof
  • Film structure, testing method thereof, display substrate and testing method and production method thereof
  • Film structure, testing method thereof, display substrate and testing method and production method thereof

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Embodiment Construction

[0040] The following describes in detail the specific implementations of the measuring device, the testing method, the display substrate, the testing method, and the manufacturing method provided in the embodiments of the present invention with reference to the accompanying drawings.

[0041] Embodiments of the present invention provide a film structure, such as figure 1 and figure 2 As shown, it includes: a first metal layer 1, a second metal layer 2, a first test terminal 3, a second test terminal 4, and an insulating layer 5 between the first metal layer 1 and the second metal layer 2; wherein ,

[0042] The first test terminal 3 is connected to the first metal layer 1, and the second test terminal 4 is connected to the second metal layer 2;

[0043] A ladder structure is formed on at least one side among the three layers of the first metal layer 1 , the insulating layer 5 and the second metal layer 2 .

[0044] The above-mentioned film layer structure that the embodime...

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Abstract

The invention discloses a film structure, a testing method thereof, a display substrate and a testing method and production method thereof. The film structure comprises a first metal layer, a second metal layer, a first testing terminal, a second testing terminal, and an insulating layer located between the first metal layer and the second metal layer, wherein the first testing terminal is connected with the first metal layer, and the second testing terminal is connected with the second metal layer; a step structure is formed on at least one side among the first metal layer, the insulating layer and the second metal layer. By the arrangement, during testing of the film structure, the fall of the step structures can be tested by the ascending or descending trajectories of a testing probe, accurate insulating layer thickness can be obtained, and the accurate dielectric constant of the insulating layer can be calculated according to the capacitance and relative area between the first metal layer and the second metal layer.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a film layer structure and a testing method, a display substrate, a testing method and a preparation method. Background technique [0002] At present, display technology is widely used in the display of televisions, mobile phones, and public information, and the flat panel display used for displaying pictures is vigorously promoted because of its advantages of ultra-thin and energy-saving. [0003] For the manufactured display products, it is usually necessary to test the dielectric constant of the film layer to be tested on the display substrate used to realize the display function. The traditional dielectric constant test is to first test the capacitance value of the film layer structure to be tested. , and then calculate according to the formula C=ε*A / D to obtain the dielectric constant ε of the film layer to be measured, wherein A is the relative area of ​​the upper and lowe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/26
CPCG02F1/1309G01R27/2617G01D5/24G01R27/2605G01D5/2405
Inventor 张玉军刘超
Owner BOE TECH GRP CO LTD