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A method for preparing diamond-al composite material by extrusion impregnation

A composite material and diamond technology, applied in the field of preparing ultra-high thermal conductivity diamond-Al composite materials, can solve problems such as low diamond-Al preparation efficiency, and achieve the effects of improving interface bonding, avoiding coating oxidation, and reducing interface thermal resistance.

Active Publication Date: 2016-11-02
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Technical problem: The purpose of the present invention is to provide a method for preparing diamond-Al composite materials by extrusion impregnation in order to solve the problems of low production efficiency of diamond-Al composite materials at present. Efficient and simple method for preparing ultra-high thermal conductivity diamond-Al composite materials by pressure infiltration and subsequent heat treatment process

Method used

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  • A method for preparing diamond-al composite material by extrusion impregnation
  • A method for preparing diamond-al composite material by extrusion impregnation
  • A method for preparing diamond-al composite material by extrusion impregnation

Examples

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Embodiment example 1

[0036] (1) Take a certain quality of diamond particles and aluminum alloy blocks, wherein the diamond is MBD4 type, the particle size is 180-250 μm (no coating on the surface), and the aluminum alloy composition is Al-7% Si (liquidus and solidus temperatures were 615°C and 577°C, respectively).

[0037] (2) Spray BN release agent on the inner surface of the mold cavity and upper cover, and then put a circular porous ceramic sheet (pore diameter 150 μm) into the mold cavity and upper cover. Fill the mold with diamond particles, keep the mold vertical and vibrate, so that the diamond particles can accumulate freely, and then screw on the upper cover (a gap of 1-2mm is reserved between the upper cover and the surface of the particle accumulation body).

[0038] (3) Preheat the mold to 650°C and keep it warm for 1h. Take out the mold and keep it in a vertical state, vibrate the mold again, and tighten the upper cover, so that the diamond particles are pressed and kept tightly pac...

Embodiment example 2

[0042] (1) Take a certain quality of diamond particles and aluminum alloy blocks, wherein the diamond is MBD4 type, the particle size is 125-180 μm (not coated on the surface), and the aluminum alloy composition is Al-12.5% ​​Si (liquidus and solidus The temperature is 577°C).

[0043] (2) Spray the paint BN release agent on the inner surface of the mold cavity and the upper cover, and then put the circular porous ceramic sheet (pore diameter 100 μm) into the mold cavity and the upper cover. Fill the mold with diamond particles, keep the mold vertical and vibrate, so that the diamond particles can accumulate freely, and then screw on the upper cover (a gap of 1-2mm is reserved between the upper cover and the surface of the particle accumulation body).

[0044] (3) Preheat the mold to 610°C and keep it warm for 2h. Take out the mold and keep it in a vertical state, vibrate the mold again, and tighten the upper cover, so that the diamond particles are pressed and kept tightly p...

Embodiment example 3

[0048] (1) Weigh diamond particles and aluminum alloy blocks of a certain quality, wherein the diamond is MBD4 type, the particle size is 180-250 μm (no coating on the surface), and the aluminum alloy composition is Al-9% Si (liquidus and solidus temperatures were 600°C and 577°C, respectively).

[0049] (2) Spray BN release agent on the inner surface of the mold cavity and upper cover, and then put a circular porous ceramic sheet (pore diameter 150 μm) into the mold cavity and upper cover. Fill the mold with diamond particles, keep the mold vertical and vibrate, so that the diamond particles can accumulate freely, and then screw on the upper cover (a gap of 1-2mm is reserved between the upper cover and the surface of the particle accumulation body).

[0050] (3) Preheat the mold to 630°C and keep it warm for 1h. Take out the mold and keep it in a vertical state, vibrate the mold again, and tighten the upper cover, so that the diamond particles are pressed and kept tightly pa...

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Abstract

The invention relates to a method for preparing a diamond Al-composite material by squeeze infiltration, which comprises the following steps: firstly, filling a mold with diamond grains, keeping the mold vertical, and compacting by vibrations to freely accumulate the diamond grains; secondly, heating the mold to a certain temperature, keeping the temperature, tightening the upper cover, and keeping the diamond grains in the compactly accumulated state under press; thirdly, infiltrating molten aluminum into the clearances among the diamond grains by pressurization, carrying out spray cooling on the upper cover of the mold to sequentially solidify the aluminum matrix, thereby preparing the diamond-Al composite material; and finally, carrying out heat treatment to improve the diamond-Al interface combination. The grain size of the diamond is 125-250 mu m, no film is coated on the surface, and the matrix is an aluminum-silicon alloy. The method does not need any vacuum or atmosphere protective system; the purpose-made mold provides compressive stress in the whole preparation process, thereby ensuring the close contact among the diamond grains; the sequential solidification compacts the aluminum matrix; and the heat treatment in the later period can improve the diamond-Al interface combination. The composite material has excellent thermal conductivity, and is suitable for industrial production.

Description

technical field [0001] The invention relates to the preparation of an ultrahigh thermal conductivity metal matrix composite material, in particular to a method for preparing an ultrahigh thermal conductivity diamond-Al composite material through extrusion impregnation and subsequent heat treatment. Background technique [0002] With the continuous development of electronic technology, electronic devices and components in electronic equipment are becoming more and more complex and integrated, which will inevitably lead to an increase in the heat generated by the device. has received extensive attention. Diamond is the substance with the highest thermal conductivity in nature (up to 2000W / m K), its thermal conductivity is 4-5 times that of copper, 8-10 times that of aluminum, and its expansion coefficient is very low, so diamond particles and metal ( Al, Cu, Ag, etc.) are compounded into composite materials, which can make them have the characteristics of ultra-high thermal c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/10C22C1/02C22C21/00
Inventor 陈锋陈培架余新泉张友法曾从远
Owner SOUTHEAST UNIV
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