A photosensitive dry film with high resolution and excellent hole-masking properties

Abstract

The invention discloses a light sensitive dry film, which is formed by sticking a polyester supporting layer, a light-sensitive resin composition layer and a polyethylene protection layer in turn, wherein the light-sensitive resin composition layer is used as a core layer of the dry film and comprises an alkali-soluble resin, which is 50 to 70 parts by weight, a monomer, which is 25 to 45 parts by weight and which can carry out light free radical polymerization reaction, and a photoinitiator which is 0.1 to 5 parts by weight; the number-average molecular weight of the alkali-soluble resin is 80000 to 140000, and the molecular weight distribution is narrow (PDI is not more than 1.5). The light-sensitive resin composition with the alkali-soluble resin has high resolution and excellent hole covering performance. The light sensitive dry film of the invention effectively reduces the exposed-perforation probability in the PCB production and is conducive to increasing yield rate of the PCB production to improve the PCB production efficiency.

Description

technical field [0001] The invention relates to a photosensitive dry film with high resolution and excellent hole-masking performance. The photosensitive dry film has the characteristics of high resolution, excellent hole-masking ability and the like. technical background [0002] In printed circuit boards, lead frames, solar cells, conductor packages, BGA (Ball Grid Array), CPS (Chip Size Package) packages, dry film resist is widely used as a key material for pattern transfer. For example, when manufacturing a printed circuit board, first, a dry film resist is pasted on a copper substrate, and a mask having a certain pattern is used to cover the dry film resist for pattern exposure. Then, use a weak alkaline aqueous solution as a developer to remove the unexposed parts, then perform etching or electroplating to form a pattern, and finally use a remover to peel off the cured part of the dry film to achieve pattern transfer. [0003] The manufacturing methods of printed circ...

AI Technical Summary

Problems solved by technology

[0006] In Japanese Patent Laid-Open Publication No. 5-271129, it is reported that the dry film using vinyl isocyanurate compound has good hole-masking performance, but vinyl isocyanurate is seriously poor in development and its resolution is low

[0007] Patent US7517636 reports a new type of dry film, which has good pore-masking ability and film-removing performance, but unfortunately, the presence of long alkoxy chain acrylate monomers limits the improvement of resolution

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