A photosensitive dry film with high resolution and excellent hole-masking properties

A photosensitive dry film, high-resolution technology, applied in the field of photosensitive dry film, can solve the problems of limited resolution, low resolution, poor development of vinyl isocyanurate, etc., achieve high resolution, improve production efficiency, The effect of improving the masking performance

Active Publication Date: 2019-05-03
HANGZHOU FIRST APPLIED MATERIAL CO LTD
View PDF11 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In Japanese Patent Laid-Open Publication No. 5-271129, it is reported that the dry film using vinyl isocyanurate compound has good hole-masking performance, but vinyl isocyanurate is seriously poor in development and its resolution is low
[0007] Patent US7517636 reports a new type of dry film, which has good pore-masking ability and film-removing performance, but unfortunately, the presence of long alkoxy chain acrylate monomers limits the improvement of resolution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A photosensitive dry film with high resolution and excellent hole-masking properties

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Alkali-soluble resin is the core component of the photosensitive composition. From the perspective of improving the pore-masking performance of the dry film, the molecular weight of the alkali-soluble resin should be increased; but from the perspective of dry film resolution, the molecular weight of the alkali-soluble resin needs to be controlled. In a certain range, based on this, the present invention utilizes the alkali-soluble resin prepared by living controllable free radical polymerization to effectively improve the The hole-masking performance of the dry film improves the yield of PCB production.

[0021] The invention discloses a photosensitive dry film, which sequentially comprises a polyester support layer, a photosensitive resin composition layer and a polyethylene protective layer. The photosensitive resin composition layer is used as the core layer of the dry film, and if it is set to be 100 weight ratio, it includes: (a) 50-70 weight parts of alkali-solubl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
glass transition temperatureaaaaaaaaaa
polydispersity indexaaaaaaaaaa
polydispersity indexaaaaaaaaaa
Login to view more

Abstract

The invention discloses a light sensitive dry film, which is formed by sticking a polyester supporting layer, a light-sensitive resin composition layer and a polyethylene protection layer in turn, wherein the light-sensitive resin composition layer is used as a core layer of the dry film and comprises an alkali-soluble resin, which is 50 to 70 parts by weight, a monomer, which is 25 to 45 parts by weight and which can carry out light free radical polymerization reaction, and a photoinitiator which is 0.1 to 5 parts by weight; the number-average molecular weight of the alkali-soluble resin is 80000 to 140000, and the molecular weight distribution is narrow (PDI is not more than 1.5). The light-sensitive resin composition with the alkali-soluble resin has high resolution and excellent hole covering performance. The light sensitive dry film of the invention effectively reduces the exposed-perforation probability in the PCB production and is conducive to increasing yield rate of the PCB production to improve the PCB production efficiency.

Description

technical field [0001] The invention relates to a photosensitive dry film with high resolution and excellent hole-masking performance. The photosensitive dry film has the characteristics of high resolution, excellent hole-masking ability and the like. technical background [0002] In printed circuit boards, lead frames, solar cells, conductor packages, BGA (Ball Grid Array), CPS (Chip Size Package) packages, dry film resist is widely used as a key material for pattern transfer. For example, when manufacturing a printed circuit board, first, a dry film resist is pasted on a copper substrate, and a mask having a certain pattern is used to cover the dry film resist for pattern exposure. Then, use a weak alkaline aqueous solution as a developer to remove the unexposed parts, then perform etching or electroplating to form a pattern, and finally use a remover to peel off the cured part of the dry film to achieve pattern transfer. [0003] The manufacturing methods of printed circ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/004
Inventor 李伟杰李志强严晓慧黄森彪周光大林建华
Owner HANGZHOU FIRST APPLIED MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap