Pre-cleaning process before texturing process

Abstract

The present invention discloses a pre-cleaning process before a texturing process. The process comprises the steps that (1) an automatic feeding machine transmits silicon slices to five rails separately; (2) the silicon slices enter a pre-cleaning water tank for cleaning according to the set speeds under the driving of rollers; (3) after cleaning, the residual water on the silicon slices is extruded by a soft roller at the tail end of the water tank; (4) the silicon slices are fed to an air knife groove, so that the silicon slices of which the surfaces are wet are dried under N2 atmosphere; (5) the silicon slices having hidden cracking severely in the step (4) are blown to crack, and the small broken silicon slices drop into an air knife groove body, and the large broken silicon slices enter a next slice pickup groove under the driving of the rollers; (6) cleaning and picking out the broken silicon slices in the step (5), and feeding the pre-cleaned silicon slices to the etching groove to carry out the cleaning and texturing. The silicon slices of the present invention is washed in the pre-cleaning water tank, then are dried in the air knife groove, so that the surfaces of the silicon slices entering the etching groove are guaranteed to be dry and clean, and the water is prevented from being brought to the etching groove to reduce the concentration of the medicine liquid in the etching groove.

Description

technical field [0001] The invention relates to a pre-cleaning process before the texturing process, which belongs to the field of solar cell manufacturing process. Background technique [0002] Nowadays, during the transportation of silicon wafers from the silicon wafer factory to the production process of the battery workshop, some silicon wafers will be broken by external forces, and some silicon wafers will not be broken, but there will be hidden cracks. It was directly taken out without any surface treatment, and the acid texturing process was carried out. When feeding, some cracked raw silicon wafers were not separated in time. When it is at the same time, it is easy to break, which increases the fragmentation rate and lamination rate. At the same time, there are a lot of silicon powder, dust and foam particles attached to the silicon wafer. These incidentals will enter the etching tank with the silicon wafer, and the chemical solution will be polluted, which will se...

AI Technical Summary

Problems solved by technology

[0005] The existing technology fails to pre-treat the silicon wafer before entering the etching tank, so that some silicon powder, dust and foam particles are brought into the etching tank liquid by the silicon wafer, contaminating the chemical liquid, and the foam particles are blocked in the circulation. On the filter screen, a long time will seriously affect the circulation of the chemical solution in the etching tank, resulting in an unstable concentration; at the same time, some cracked original silicon wafers were not separated in time when the material was loaded. When the air knife is placed, it is easy to break, and the fragmentation rate and the probability of lamination are very high, which is not conducive to improving the pass rate