Gas-liquid two-phase atomization cleaning device and cleaning method

Abstract

The invention provides a gas-liquid two-phase atomization cleaning device and relates to the technical field of the semiconductor chip technology. The gas-liquid two-phase atomization cleaning device comprises a gas pipeline, a liquid pipeline and a gas-liquid two-phase atomization nozzle, one end of the gas pipeline and one end of the liquid pipeline are arranged on a swing arm while the other end of the gas pipeline and the other end of the liquid pipeline are communicated with the gas-liquid two-phase atomization nozzle to form atomization particles, and the swing arm drives the gas-liquid two-phase nozzle to reciprocate in a circular arc manner between the edge and the center of a wafer. High-speed liquid flow and high-speed gas flow are sufficiently acted through a gas-liquid two-phase atomization nozzle structure, superfine atomized droplets uniform in particle size are formed by adjusting gas flow rate and liquid flow rate of small flow rate, the superfine atomized droplets are sprayed on the surface of the wafer after being accelerated through the high-speed gas flow, and cleaning is completed. By the arrangement, transferring of impurities in troughs to a main flow body is promoted, efficiency in cleaning is improved, cleaning effect is improved, and damage to the surface structure of the wafer is reduced due to small quality of the atomization particles.

Description

technical field [0001] The invention belongs to the technical field of semiconductor wafer technology, and specifically relates to a gas-liquid two-phase atomization cleaning device and a cleaning method. Background technique [0002] As the feature size of integrated circuits enters the deep sub-micron stage, the cleanliness of the wafer surface required in the integrated circuit wafer manufacturing process is becoming more and more stringent. In order to ensure the cleanliness of the wafer material surface, there are several Hundreds of cleaning processes, the cleaning process accounts for 30% of the entire manufacturing process. [0003] In the semiconductor cleaning process, when the cleaning liquid impacts the wafer at a high speed, it will generate a physical force on the wafer, which can accelerate the process of cleaning the chemical liquid and impurities and pollutants on the surface of the wafer, and promote impurities and pollution. The substance is corroded by t...

AI Technical Summary

Problems solved by technology

[0004] However, with the further reduction of the feature size of the pattern structure on the wafer surface, the high-speed jet liquid phase fluid will cause serious damage to the pattern structure of the wafer surface.

Large-sized liquid-phase particles or liquid-phase jets generally exist in the traditional cleaning spray technology, which seriously damages the surface patterns of 65nm and below process wafers. At the same time, the utilization rate of liquid-phase fluid is low, resulting in an extreme waste of resources.

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