Low heat conduction polystyrene heat insulation material

A technology of polystyrene and thermal insulation materials, applied in the field of thermal insulation materials, can solve the problems of high thermal conductivity, large quantity of thermal insulation materials, and high cost of thermal insulation systems, and achieve the effects of reducing thermal conductivity, volumetric density, and types of additions

Inactive Publication Date: 2015-08-19
天津市天德橡塑机械股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The problem to be solved by the present invention is that the thermal conductivity of existing thermal insulation materials is relatively high, and when a certain energy-saving and thermal insulation effect is achieved, a large amount of thermal insulation materials is required, and the cost of the thermal insulation system is high

Method used

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  • Low heat conduction polystyrene heat insulation material
  • Low heat conduction polystyrene heat insulation material
  • Low heat conduction polystyrene heat insulation material

Examples

Experimental program
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Effect test

Embodiment 1

[0035] A low thermal conductivity extruded polystyrene insulation material, the raw materials of which include:

[0036] 100kg of polystyrene, 0.5kg of flaky graphite powder, 0.5kg of low molecular weight polystyrene particles, 9kg of blowing agent, and 8kg of flame retardant. The blowing agent includes: 4kg of carbon dioxide, 1.6kg of cyclopentane, and 3.4kg of tetrafluoroethane.

Embodiment 2

[0038] A low thermal conductivity extruded polystyrene insulation material, the raw materials of which include:

[0039] 400kg of polystyrene, 4kg of flaky graphite powder, 3.6kg of low molecular weight polystyrene particles, 42kg of foaming agent, and 30kg of flame retardant. The blowing agent includes: 4kg of carbon dioxide, 8kg of cyclopentane, and 30kg of tetrafluoroethane.

Embodiment 3

[0041] A low thermal conductivity polystyrene insulation material, the raw materials of which include:

[0042] 200kg of polystyrene, 4kg of flaky graphite powder, 3.2kg of low molecular weight polystyrene particles, 20kg of foaming agent, and 12kg of flame retardant. The blowing agent includes: 3kg of carbon dioxide, 4.4kg of cyclopentane, and 12.6kg of tetrafluoroethane.

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Abstract

The invention provides a low heat conduction polystyrene heat insulation material, and belongs to the technical field of heat insulation materials. The low heat conduction polystyrene heat insulation material comprises, by weight, 100 parts of polystyrene, 0.1-10 parts of graphite, 6-15 parts of a foaming agent, and 1-15 parts of a fire retardant, wherein the average particle size of the graphite is 2000-5000 meshes. The low heat conduction polystyrene heat insulation material has the advantages of simple formula and easy large-scale automatic production. In the invention, the 2000-5000 mesh graphite is adopted as a nucleating agent to substitute traditional talcum powder, so the foaming efficiency is improved, and cells of the finished material are uniform, and the unit weight of foamed sheets made by using the material can be reduced to 28kg / m<3>, and the heat conduction coefficient of the sheets is 0.019-0.024W / (m.K). The thickness of the sheets made by using the material is 30% smaller than that of routine polystyrene extruded foamed heat insulation sheets on the premise of realizing a same heat insulation effect.

Description

technical field [0001] The invention relates to the technical field of thermal insulation materials, in particular to a polystyrene thermal insulation material with low thermal conductivity. Background technique [0002] Insulation materials can be divided into two categories: inorganic insulation materials and organic insulation materials according to their raw material composition. Inorganic thermal insulation materials have high thermal conductivity, large capacity, and difficult construction, so they are seldom used. Organic thermal insulation materials have low thermal conductivity, small bulk density, easy construction, and large-scale automatic production, so they have a wide range of applications. Polystyrene is a common organic thermal insulation material with good thermal insulation effect. [0003] Existing traditional polystyrene insulation materials use extrusion molding technology, use talcum powder as a nucleating agent, and use difluorochloroethane (HCFC142...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L25/06C08K3/04C08J9/14C08J9/12
Inventor 高林江
Owner 天津市天德橡塑机械股份有限公司
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