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PCB packaging design method of QFN chip and the QFN chip

A design method and chip technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problem of high production cost of heat dissipation design, achieve the effect of meeting electrical performance requirements, more uniform heat dissipation effect, and cost saving

Inactive Publication Date: 2015-09-23
PHICOMM (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcoming of prior art, the object of the present invention is to provide a kind of PCB encapsulation design method of QFN chip and QFN chip, be used to solve the problem that heat dissipation design production cost is high during the PCB encapsulation of QFN chip in the prior art

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  • PCB packaging design method of QFN chip and the QFN chip
  • PCB packaging design method of QFN chip and the QFN chip

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Embodiment Construction

[0018] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0019] It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual impleme...

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Abstract

The invention provides a PCB packaging design method of a QFN chip and the QFN chip. The PCB packaging design method of the QFN chip comprises the following step that at least three through holes are added on a grounding pad of the QFN chip and the through holes are connected to an external layer copper foil of a PCB back side of the QFN chip. In a technical scheme of the invention, only the QFN chip in a product is processed so that a product appearance is not influenced. Simultaneously, in the technical scheme, the QFN chip used on any quantity of foot positions can carry out heat dissipation; the design is simple, operation is convenient and a heat dissipation effect is obvious. Compared to the prior art, by using the design method and the QFN chip of the invention, a via hole number on the grounding pad in a PCB layout design is reduced so that PCB production cost is effectively saved; simultaneously service life time of the QFN chip is prolonged and cost is greatly saved.

Description

technical field [0001] The invention relates to a method, in particular to a PCB package design method of a QFN chip and the QFN chip. Background technique [0002] The appearance of electronic consumer products is becoming smaller and thinner, and the area of ​​PCB (Printed Circuit Board, printed circuit board) inside is getting smaller and smaller, and the integration of chips is greatly improved. In addition to the beautiful appearance and high performance of the product, the stability of the system has been challenged when working at a relatively high temperature for a long time, and the heat dissipation of the product has become an important issue. When heat dissipation holes are drilled on the product case, heat sinks are mounted on the surface of high-power chips, and bare copper on the back of high-power chips cannot meet the heat dissipation requirements, the heat dissipation treatment on the PCB package becomes an effective means to enhance heat dissipation. QFN (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/367
Inventor 郝娟
Owner PHICOMM (SHANGHAI) CO LTD