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Planar miniwatt microwave microplasma circular-ring-shaped array source

A technology of micro-plasma and circular ring array, which is applied in the direction of plasma and electrical components, can solve the problems of unstable resonance mode and coupling coefficient, uneven distribution of micro-plasma, and irregular plasma shape, etc. Low, conducive to high-efficiency processing, and the effect of improving the coupling coefficient

Inactive Publication Date: 2015-09-30
EAST CHINA NORMAL UNIV
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Problems solved by technology

Due to the instability of the resonance mode and coupling coefficient of the array source of this structure, the distribution of excited micro-plasma is very uneven, and in severe cases, irregular plasma shape will appear, and the size is too small

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  • Planar miniwatt microwave microplasma circular-ring-shaped array source
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  • Planar miniwatt microwave microplasma circular-ring-shaped array source

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Embodiment Construction

[0023] The present invention will be further described in detail in conjunction with the following specific embodiments and accompanying drawings. The process, conditions, experimental methods, etc. for implementing the present invention, except for the content specifically mentioned below, are common knowledge and common knowledge in this field, and the present invention has no special limitation content.

[0024] see figure 1 and figure 2 , the present embodiment provides a planar low-power microwave micro-plasma circular array source, including a concentric array 1 of microstrip transmission lines, a central common ground point 2, a coupling ring 3, a feed conductor 4 and a ground conductive strip 5. The microstrip transmission line concentric array 1 includes at least two array units 11 . The array unit 11 is arranged on both sides of the feed conductor 4 . Each of the array elements 11 located on each side of the feed conductor is connected by the coupling ring 3 . T...

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Abstract

The invention discloses a planar miniwatt microwave microplasma circular-ring-shaped array source which comprises a microstrip transmission line concentric array, a central common grounding point, a coupling loop, a feed conductor and a grounding conduction band, the microstrip transmission line concentric array comprises at least two array units which are arranged at the two sides the feed conductor respectively, each array unit is connected via the coupling loop, the feed conductor comprises at least two conduction bands, each conduction band is provided with at least one feeding point, the central common grounding point is arranged at the connected position of the two feed conduction bands, one end of each array unit is connected with the central common grounding point, the feed conduction bands and the array units are distributed in a radial circular ring shape by taking the central common grounding point as the circular center, the grounding conduction band comprises at least two grounding guide blocks, each grounding guide block is arranged at the other ends of the array unit and the feed conduction band, a slit is formed therebetween, and the edge of the grounding guide block is grounded. The array source has the advantages of low cost, low input power and uniform excitation.

Description

technical field [0001] The invention relates to the technical field of microwave plasma sources, in particular to a planar low-power microwave micro-plasma circular array source based on microstrip transmission lines. Background technique [0002] Low-power microwave micro-plasma technology is a high-tech developed in recent years that integrates microelectronics technology, microwave technology and plasma technology. It develops along with the development of MEMS technology. Micro plasmas include direct current micro plasmas, radio frequency micro plasmas and microwave micro plasmas. When the discharge space is further reduced to a nanometer size, it becomes a nanoplasma. Because microelectromechanical systems (MEMS) have the characteristics of low loss, high isolation, small size, low manufacturing cost, and easy integration with IC and MMIC circuits, low-power packaging and active integration of microwave plasma can be realized through MEMS technology. Therefore, combin...

Claims

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Application Information

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IPC IPC(8): H05H1/46
Inventor 廖斌权威
Owner EAST CHINA NORMAL UNIV
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