Plastic package and preparation method thereof

A technology of plastic encapsulation and plastic encapsulation layer, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as lowering product reliability and delamination failure

Active Publication Date: 2015-11-04
TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to overcome the problem that the plastic package in the prior art is prone to delamination failure, thereby reducing

Method used

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  • Plastic package and preparation method thereof
  • Plastic package and preparation method thereof
  • Plastic package and preparation method thereof

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Embodiment Construction

[0022] Specific embodiments of the present invention will be described in detail below. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention.

[0023] The terms and words used in this specification and the claims should not be construed as being limited to typical meanings or dictionary definitions, but should be construed as having meanings and concepts related to the technical field of the present invention, according to which principles of invention A person can properly define the concepts of terms to best describe the best way he or she knows to practice the invention.

[0024] In the present invention, the term "support" refers to an object used to support the chip during the packaging process. In the case of a thin small outline package (SOP), the "support" refers to the lead frame; in the ball grid array In the case of a structural package (BGA), the...

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Abstract

The invention relates to a plastic package and a preparation method thereof. The plastic package comprises a chip 1, a supporting piece 2 used for supporting the chip and a packaging shell 5. The packaging shell 5 comprises a first plastic package layer 3 which coats the chip 1 so as to enable the chip 1 to be sealed and a second plastic package layer 4 which coats the first plastic package layer 3 so as to enable the first plastic package layer 3 to be sealed, wherein the first plastic package layer 3 is made of a first resin material; the second plastic package layer 4 is made of a second resin material; and an equivalent thermal expansion coefficient of the first resin material is less than an equivalent thermal expansion coefficient of the second resin material. The plastic package provided by the invention is wide in material selection range, and can reduce delamination and failure of products, thereby improving the reliability of the products.

Description

technical field [0001] The invention relates to a plastic package and a preparation method thereof. Background technique [0002] With the rapid development of electronic science and technology, the process of semiconductor industrialization is also constantly developing. In recent years, electronic packaging is developing in the direction of high density, light weight, narrow pitch, low distribution, multi-function and suitable for surface mounting. From the materials used for packaging, electronic packaging can be mainly divided into metal packaging, ceramic packaging and plastic packaging. The first two are airtight packages and have high reliability, but due to high cost, these two package forms are mostly used in aerospace and other fields that have high performance requirements for devices. The plastic package is a non-hermetic package. Compared with the previous two forms, the reliability of this package is lower. However, due to its low cost and simple process, it ...

Claims

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Application Information

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IPC IPC(8): H01L23/13H01L21/56
Inventor 蔡坚谭琳王谦陈瑜王水弟
Owner TSINGHUA UNIV
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