A kind of manufacturing method of led laminated circuit board based on inorganic substance
A manufacturing method and circuit board technology, which is applied to circuits, electrical components, semiconductor devices, etc., can solve problems such as hidden dangers of product stability and reliability, inability to realize processing, and inability to guarantee performance consistency.
Active Publication Date: 2018-02-23
ADVANCED DIGITAL DISPLAY WUXI CO LTD
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Problems solved by technology
[0003] However, when the traditional circuit board is used as the LED circuit substrate, the impurities, pores, thermal stress, thermal expansion and other defects in the material will cause fatal hidden dangers to product stability and reliability.
Moreover, when the resolution of the semiconductor display is increased to a certain extent (for example, when the pixel pitch is required to be less than 1MM), the processing cannot be realized.
Therefore, traditional circuit boards are completely unable to meet the requirements of small size and high precision.
At the same time, the subsequent bonding process with LEDs is cumbersome, and the consistency of performance among multiple LED chips carried by an LED circuit substrate cannot be guaranteed, which may affect the performance of the final product
Method used
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preparation example Construction
[0067] The preparation method of the above step 101-step 108 provides a method for preparing an LED single-layer substrate. If a multi-layer substrate is to be prepared, the following steps can be performed before the above step 106:
[0068] 1) Vapor deposition of SiC to form the filling layer of the patterned etching area and the surface insulating layer of the SiC substrate;
[0069] 2) performing patterned etching on the surface insulating layer of the SiC substrate, and etching until the conductive medium is exposed in the patterned area;
[0070] 3) Plating a conductive medium on the entire board of the SiC substrate;
[0071] 4) performing patterned etching on the conductive medium on the first surface of the SiC substrate;
[0072] 5) Perform patterned etching on the conductive medium on the second surface of the SiC substrate.
[0073] The above steps 1)-5) can be repeated multiple times according to the required number of substrate layers.
[0074] The method for ...
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Abstract
The invention relates to a method for manufacturing an inorganic-based LED laminated circuit board, comprising: plating a conductive medium on the entire board of a silicon carbide SiC substrate; performing laser drilling through-hole processing on the SiC substrate; plating a conductive medium on the entire board of the SiC substrate medium; wherein the through hole is completely filled with the conductive medium; patterned etching is performed on the conductive medium on the first surface of the SiC substrate; patterned etching is performed on the conductive medium on the second surface of the SiC substrate ; SiO2 is vapor deposited to form a substrate protection layer; the substrate protection layer on the upper surface of the SiC substrate is patterned and etched to expose the metal pad electrode in the patterned area; crystal growth is carried out on the metal pad electrode a lattice adaptation layer; the lattice structure of the lattice adaptation layer is the same as that of the LED.
Description
technical field [0001] The invention relates to the field of semiconductors, in particular to a method for manufacturing an inorganic-based LED laminated circuit board. Background technique [0002] With the development of traditional semiconductor display products to this day, supporting or cross-industry resources have been greatly enriched and perfected. In the traditional LED product structure, FR4 circuit boards are usually used as LED circuit substrates. [0003] However, when the traditional circuit board is used as the LED circuit substrate, the impurities, pores, thermal stress, thermal expansion and other defects in the material will cause fatal hidden dangers to product stability and reliability. Moreover, when the resolution of the semiconductor display is increased to a certain extent (for example, when the pixel pitch is required to be less than 1MM), the processing cannot be realized. Therefore, traditional circuit boards are completely unable to meet the re...
Claims
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IPC IPC(8): H01L33/48H01L33/62
Inventor 程君严敏周鸣波
Owner ADVANCED DIGITAL DISPLAY WUXI CO LTD