adhesion promoter
A technology of adhesion promoters, compositions, applied in the direction of bonding methods for surface pretreatment, insulation of conductors/cables, coatings, etc.
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Embodiment 1
[0062] Example 1 : Bis[3-(trimethoxysilyl)propyl]amine (0.41wt%, 1.2mmol), [3-(2-aminoethylamino)propyl]trimethoxysilane (0.21wt%, 1.9 mmol based on amino groups) and PGME (99.38% by weight with residual water) were mixed to prepare the adhesion promoting composition of the present invention. The composition was left overnight at room temperature. Next, di-tert-butyldicarbonate (0.6 wt%, 2.7 mmol) was added to the composition, and the composition was reacted overnight to provide a large amount of hydrolyzed silane with t-BOC protected amino structure and a small amount of hydrolyzed silane with unprotected amino structure. Mixture of silanes. The composition (Sample 1) was then filtered through a 20 nm polypropylene filter. The presence of water in the solvent and residual amine functionality in this sample enabled the hydrolysis of the silane.
Embodiment 2
[0063] Example 2 : Compatibility of Sample 1 with an alkali-reactive photoelectric medium was evaluated. Sample 1 and a commercially available developable benzocyclobutene photoelectric with acidic functionality were mixed in a 1:1 weight ratio in a glass screw cap vial to form a clear solution.
Embodiment 3
[0065] Example 3 : The adhesion promoters of Sample 1 and Comparative Example 1 were evaluated using lithographic testing. Both Sample 1 and Comparative Example 1 were coated with a Site Trac TT5-XP coater at a rotation speed of 2000rpm for 40 seconds, applied to a 200mm test wafer, and then baked at 90°C or 180°C for 90 seconds to ensure Solvent removal. No coating defects were observed for all adhesion promoter samples. The post-bake coating thicknesses of the adhesion promoters are reported in Table 1. As shown in the data, sample 1 baked at 180°C gave a much lower coating thickness than its baked at 90°C. This difference in film thickness is indicative of deprotection of the amino structure in the hydrolyzed amino-alkoxysilane.
[0066] Benzocyclobutene dielectric resin was coated onto each adhesion promoting wafer using a Site Trace TT6-XP coater at a rotational speed of 1500 rpm to form a film with a thickness of approximately 6.5 μm. The spin-coated dielectric was...
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Abstract
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