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adhesion promoter

A technology of adhesion promoters, compositions, applied in the direction of bonding methods for surface pretreatment, insulation of conductors/cables, coatings, etc.

Active Publication Date: 2018-08-31
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, when the above-mentioned dielectric materials containing acidic groups are in contact with basic adhesion promoters such as alkoxysilanes containing hydrolyzed amino groups, salt formation leads to undesirable precipitation or slagging in drain lines, coating equipment, etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Example 1 : Bis[3-(trimethoxysilyl)propyl]amine (0.41wt%, 1.2mmol), [3-(2-aminoethylamino)propyl]trimethoxysilane (0.21wt%, 1.9 mmol based on amino groups) and PGME (99.38% by weight with residual water) were mixed to prepare the adhesion promoting composition of the present invention. The composition was left overnight at room temperature. Next, di-tert-butyldicarbonate (0.6 wt%, 2.7 mmol) was added to the composition, and the composition was reacted overnight to provide a large amount of hydrolyzed silane with t-BOC protected amino structure and a small amount of hydrolyzed silane with unprotected amino structure. Mixture of silanes. The composition (Sample 1) was then filtered through a 20 nm polypropylene filter. The presence of water in the solvent and residual amine functionality in this sample enabled the hydrolysis of the silane.

Embodiment 2

[0063] Example 2 : Compatibility of Sample 1 with an alkali-reactive photoelectric medium was evaluated. Sample 1 and a commercially available developable benzocyclobutene photoelectric with acidic functionality were mixed in a 1:1 weight ratio in a glass screw cap vial to form a clear solution.

Embodiment 3

[0065] Example 3 : The adhesion promoters of Sample 1 and Comparative Example 1 were evaluated using lithographic testing. Both Sample 1 and Comparative Example 1 were coated with a Site Trac TT5-XP coater at a rotation speed of 2000rpm for 40 seconds, applied to a 200mm test wafer, and then baked at 90°C or 180°C for 90 seconds to ensure Solvent removal. No coating defects were observed for all adhesion promoter samples. The post-bake coating thicknesses of the adhesion promoters are reported in Table 1. As shown in the data, sample 1 baked at 180°C gave a much lower coating thickness than its baked at 90°C. This difference in film thickness is indicative of deprotection of the amino structure in the hydrolyzed amino-alkoxysilane.

[0066] Benzocyclobutene dielectric resin was coated onto each adhesion promoting wafer using a Site Trace TT6-XP coater at a rotational speed of 1500 rpm to form a film with a thickness of approximately 6.5 μm. The spin-coated dielectric was...

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Abstract

Adhesion promoter. A composition is provided comprising: one or more hydrolyzed amino-alkoxysilanes having protected amino structures; water and an organic solvent. Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, comprising hydrolyzed amino-alkoxysilanes having protected amino structures. These compositions are useful in methods of improving the adhesion of coating compositions to substrates, such as electronic device substrates.

Description

technical field [0001] This invention relates to the field of coating compositions, and more particularly to improving the adhesion of certain coating compositions to substrates. Background technique [0002] Coating compositions are widely used in the electronics industry to deposit various organic-containing materials, such as polymeric materials, on various substrates. Typically, the substrate is inorganic or has inorganic regions on the surface to be coated. For example, coating compositions such as dielectric film-forming compositions and bonding or adhesive compositions are often used to apply to glass, metal surfaces and / or semiconductors such as silicon, gallium arsenide and silicon-germanium surface. Many organic materials do not bind well to substrates with inorganic surfaces because they do not contain groups with an affinity for such surfaces. Accordingly, it is common practice to treat the substrate surface with an adhesion promoter prior to distributing the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J5/02C09D7/63
CPCC09D165/00C09D183/08C08G2261/3328C08G2261/3422C08G2261/3424C08G2261/65C09D7/63H01B3/307C09D125/02H01B13/06
Inventor M·K·加拉赫J·F·拉考斯基G·P·普罗科普维茨王子栋
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC