High-speed parallel processing architecture for data center

Abstract

The present invention relates to the field of data processing, and discloses a high-speed parallel processing architecture for a data center. The high-speed parallel processing architecture comprises a plurality of processing boards, and is characterized in that each processing board comprises at least two transceivers, at least one FPGA programmable logic chip and at least two processors (CPUs), wherein the CPUs are connected with with the FPGA chip through CPU high-speed serial interfaces; and a plurality of high-speed serial transceiver cores and a plurality of corresponding coprocessors (MCUs) are arranged in the FPGA chip; a plurality of embedded memories corresponding to each coprocessor MCU are embedded into the FPGA ; and each embedded memory is configured to be in a dual-port mode capable of reading and writing. According to the high-speed parallel processing architecture, an embedded CPU+FPGA architecture is realized; high-speed parallel hardware algorithms are realized, so that processing ability of basic computing elements is greatly improved, and system schedule delay is reduced.

Description

technical field [0001] The invention relates to the field of data processing, in particular to a high-speed parallel processing architecture of a data center. Background technique [0002] With the rapid development of information technology, the term "Energy Internet" has swept the energy circle since 2014. Technologies such as the Internet of Things, big data, and intelligence have been gradually applied to the traditional energy industry. With the four advantages of “Scale” and big data, cloud computing and other Internet technologies are used to build an energy-saving monitoring and energy management platform to realize intelligent and dynamic deployment of energy production, transmission and consumption, so as to improve efficiency, save energy and reduce emissions. The general trend. At present, energy-saving monitoring and energy management platforms usually adopt a three-layer structure, the bottom layer is metering instruments, sensors or actuators; the second laye...

AI Technical Summary

Problems solved by technology

[0008] The present invention provides a high-speed parallel processing architecture of a data center, which solves the technical problem of discontinuity in vibration data collection in the prior art, resulting in loss of important information

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