Fabrication method of linear impedance circuit board
A technology of linear impedance and production method, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of excessive copper thickness on the board surface, poor copper plating uniformity, etc., to improve yield and improve uniformity , the effect of reducing the key factor
Inactive Publication Date: 2015-11-18
SHENZHEN XUNJIEXING TECH CORP LTD
View PDF6 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The invention provides a method for manufacturing a linear impedance circuit board to solve the problems of poor uniformity of copper plating and excessive copper thickness on the board surface in the prior art
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0009] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0010] Please refer to figure 1 , the invention provides a method for making a linear impedance circuit board, comprising:
[0011] Step 1. Select a substrate whose surface copper thickness matches the thickness of the linear impedance board surface copper, and there is no limit to the thickness of the core board dielectric. For example, the copper on the surface of the linear impedance board is controlled between 35-45 μm (1-1.77 oz). Therefore, preferably, the surface copper thickness of the substrate in the step 1 is 1 oz.
[0012] Step 2, drilling the substrate to form the guide holes required for the conduction of the upper and lower metal layers of the substrate; preferably, the drilling is to use a drill bit on the substrate under the condit...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
The invention provides a fabrication method of a linear impedance circuit board. The method includes the following steps that: step 1, a substrate of which the surface copper thickness is matched with the thickness of surface copper of a linear impedance plate is selected; step 2, the substrate is drilled, so that guide holes required by communication between an upper metal layer and a lower metal layer of the substrate can be formed; step 3, electroless copper plating is performed on the drilled substrate; step 4, full-plate electroplating is performed on the substrate which has been subjected to the electroless copper plating; step 5, hole plating pattern transfer is performed on the substrate which has been subjected to the full-plate electroplating; step 6, hole electroplating is performed on the substrate which has been subjected to the pattern transfer; step 7, film retreating and negative pattern transfer are successively performed on the substrate which has been subjected to the hole electroplating; and step 8, acid etching is performed on the substrate which has been subjected to the pattern transfer plate. With the fabrication method of the linear impedance circuit board of the invention adopted, technical bottlenecks in existing linear impedance circuit board fabrication methods can be eliminated based on the capabilities of existing equipment, and the uniformity of the surface copper thickness of the board can be improved, and key factors that affect linear impedance values can be decreased, and the yield of the linear impedance circuit board can be greatly improved.
Description
technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a linear impedance circuit board. Background technique [0002] With the diversification and development of electronic products, the number of circuit boards involving linear impedance control is gradually increasing. Linear impedance is simply the resistance value at both ends of the wire, which is related to the length of the wire, copper thickness, and wire width. The thickness of the wire is the key influencing factor. [0003] The manufacturing method of the linear impedance circuit board in the prior art satisfies hole copper and surface copper through two electroplatings. The thickness of the first electroplating is 5-8 μm, and the second electroplating needs to be thickened by at least 20 μm. In the copper process, due to the influence of the uniformity of copper plating, the copper thickness on the board surface is uneven, and the cop...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/425H05K2201/09563
Inventor 马卓黄江波陈强
Owner SHENZHEN XUNJIEXING TECH CORP LTD