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Chip package structure

A technology of chip packaging structure and circuit area, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as detachment, poor reliability of connector structure, etc., achieve high circuit density, improve bonding reliability, and good reliability flexible effect

Active Publication Date: 2018-02-06
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the flexible circuit board 220 configured in this way is only attached to the surface of the carrier board 210. Therefore, if this chip packaging structure 200 is applied to the plug of the connector, after many times of plugging and unplugging that can happen as figure 1 The phenomenon shown in the circled part, that is, the edge of the flexible circuit board 220 is lifted and separated from the carrier board
Therefore, the structural reliability of this kind of chip package structure 200 applied to the connector is not good.

Method used

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Embodiment Construction

[0047] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed descriptions of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the accompanying drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.

[0048] figure 2 is a schematic partial cross-sectional view of a chip packaging structure according to an embodiment of the present invention. image 3 It is a schematic top view of a flexible circuit board according to an embodiment of the present invention. Figure 4 It is a schematic diagram of a chip packaging structure applied to a plug of a connector...

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Abstract

A chip packaging structure includes a carrier board, a flexible circuit board and at least one chip. The carrier includes an upper surface and a lower surface opposite to the upper surface. The flexible circuit board has a first surface, an opposite second surface and a plurality of pins. The pins are located on the first surface, so that the area of ​​the flexible circuit board is divided into a circuit area and a non-circuit area. The flexible circuit board is respectively attached to the upper surface and the lower surface of the carrier board with the second surface by bending the no-circuit area, wherein the upper surface corresponds to the circuit area and the lower surface corresponds to the no-circuit area. The flexible circuit board has a thickness T1, and the non-circuit area has a minimum thickness T2 at the bend, wherein the minimum thickness T2 is smaller than the thickness T1. The chip is arranged in the wiring area and electrically connected with the pins.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure, and in particular to a chip packaging structure. Background technique [0002] Due to the rapid development of wafer manufacturing technology, the integrated circuit (IC) industry has a rapid development trend, and the produced ICs are lighter, thinner and smaller, with complex functions, high pin count, high frequency and diversification. Under this development trend, chip on film (COF) packaging meets its packaging requirements. [0003] Chip-on-film packaging is a technology of flip-chip bonding (flip-chip bonding) on ​​a flexible circuit substrate. That is to say, the driver integrated circuit and its electronic components can be directly mounted on the film, eliminating the traditional printed circuit board, so that the package structure can be lighter, thinner and shorter. Therefore, the thin-film chip-on-chip packaging can have fine pitch and good flexibility, so that it has...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498
CPCH01L2224/16225
Inventor 陈崇龙
Owner CHIPMOS TECH INC