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Pouring sealant and preparation method for same

A technology of potting glue and epoxy resin, which is applied in the direction of adhesive, epoxy resin glue, adhesive type, etc., to achieve the effect of small gap permeability, fast flow speed and excellent adhesion

Inactive Publication Date: 2015-12-09
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is not suitable for potting components with complex structures and gaps and circuit boards under the gaps

Method used

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  • Pouring sealant and preparation method for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Accurately weigh the following raw materials, bisphenol A epoxy resin (E51) 50g, n-butyl glycidyl ether agent 7.5g, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane 2g, Put 0.5g of carbon black into the reaction kettle, mix at room temperature for 30 minutes, then weigh 5g of TATSUMORI’s XR-08P, TSS-625g into the reaction kettle, mix at room temperature for 3 hours, then weigh 10g of ADEKA’s EH-4360s, add to the reaction kettle In the process, at a temperature of 25°C, a vacuum degree of -0.07MPa, and a rotation speed of 800 rpm, stir and mix for 1 hour to obtain the product.

Embodiment 2

[0024] Accurately weigh the following raw materials, 30g of novolac epoxy resin (F51), 10g of tert-butyl glycidyl ether, 5g of γ-glycidyloxypropyltrimethoxysilane, and 0.5g of carbon black, and put them into the reaction kettle. Mix at low temperature for 30 minutes, then weigh 5g of TATSUMORI's XR-18P, TSS-640g into the reactor, mix at room temperature for 3 hours, then weigh 9.5g of ADEKA's EH-43709, add it to the reactor, at a temperature of 25 ° C, vacuum degree - 0.07MPa, rotating speed 800 rpm, stirring and mixing for 1 hour to obtain the product.

Embodiment 3

[0027] Specific test examples

[0028] The performances of the above-mentioned Examples 1-3 of the present invention and the commercially available potting compound were tested by the following test.

[0029] Test Example 1 Leveling Speed ​​Test

[0030] Put the glue into the 2cmx2cm mold box with the wiring harness embedded in it, and time it with a stopwatch.

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Abstract

The invention relates to a pouring sealant and a preparation method for the same. The pouring sealant consists of the following raw materials in percentage by weight: 30 to 60 percent of epoxy resin, 2 to 10 percent of a diluent, 0.5 to 5 percent of a silane coupling agent, 0.5 to 22 percent of a curing agent, 15 to 45 percent of compound silica micropowder and 0.5 percent of carbon black. The pouring sealant is high in flowing speed, antifoaming performance and adhesion and low in gap permeability, and is particularly applicable to the pouring of a complexly-structured component with a gap below which a circuit board is arranged, and the poured component is smooth in appearance and high in reliability.

Description

technical field [0001] The invention relates to a potting glue and a preparation method thereof, which are suitable for potting and protecting electronic components such as automobiles and electric vehicle motors, and belong to the field of adhesives. Background technique [0002] With the rapid development of the electronics industry, the closely related electronic packaging technology is becoming more and more advanced. Intelligence, light weight, small size, fast speed, strong function, and good reliability have become the main development trends of electronic products. Potting adhesives are used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06
Inventor 王红娟王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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