qfn product polishing machine

Abstract

The invention discloses a quad flat no lead (QFN) product polishing machine capable of realizing automatic polishing, and relates to the field of machining of electronic products. The QFN product polishing machine comprises a machine frame and a polishing mechanism used for polishing products on the machine frame. The polishing mechanism comprises a polishing wheel, a polishing wheel driving mechanism used for driving the polishing wheel to rotate and a product placement platform mechanism used for conveying the products to the position under the polishing wheel. The residual glue on the surfaces of the QFN products is removed in a polishing mode, the QFN products are automatically cleaned dried in a blowing mode after being polished, the polishing effect is good, and the efficiency is high. Automatic production is realized, labor is saved, and meanwhile production efficiency is improved.

Description

technical field [0001] The invention relates to the field of electronic product processing, in particular to a polishing machine for polishing QFN product pins. Background technique [0002] During the packaging process of QFN products, due to its design characteristics, it is necessary to paste high-temperature tape on the lead surface to complete the injection molding operation. However, due to the tape application, there will be a large amount of residual glue on the lead surface and heat sink surface of QFN products, which will affect the product. Yield rate during SMT soldering, lead surface oxidation, affect the appearance and heat dissipation performance of the chip, lead surface overflow glue, affect product yield and appearance, and there may be scratches during the film tearing process, affecting product appearance, currently solved The solution to this problem is to remove it manually after soaking and softening with chemical liquid. The manual removal method has ...

AI Technical Summary

Problems solved by technology

[0002] During the packaging process of QFN products, due to its design characteristics, it is necessary to paste high-temperature tape on the lead surface to complete the injection molding operation. However, due to the tape application, there will be a large amount of residual glue on the lead surface and heat sink surface of QFN products, which will affect the product. Yield rate during SMT soldering, lead surface oxidation, affect the appearance and heat dissipation performance of the chip, lead surface overflow glue, affect product yield and appearance, and there may be scratches during the film tearing process, affecting product appearance, currently solved The solution to this problem is to remove it manually after soaking and softening with chemical liquid. The manual removal method has the following disadvantages: chemicals are harmful to the human body and affect the health of workers; manual polishing wastes manpower and is inefficient, and manual polishing The effect is not good; after soaking in chemical medicine, rinsing is required, which wastes electricity and water, thereby increasing production costs

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