A cleaning liquid collection device

Abstract

The invention discloses a cleaning liquid collecting device comprising an air inflow portion, a cleaning liquid collecting portion, and an air-liquid separating portion. The air inflow portion supplies air to the cleaning liquid collecting portion. An annular air curtain is formed at an air outlet and achieves inelastic collision with cleaning liquid separated from the surface of a wafer. Thus, the cleaning liquid is changed in moving direction, enters an air-liquid collecting cavity and is separated and exhausted by the air-liquid separating portion. The cleaning liquid collecting device may reduce back-splash of cleaning medium at the sidewall of a cleaning liquid collecting structure, prevents secondary pollution, and improves liquid cleaning medium recovery efficiency.

Description

technical field [0001] The invention relates to the field of semiconductor cleaning equipment, in particular to a cleaning liquid collection device. Background technique [0002] In recent years, with the continuous shrinking of the feature size of integrated circuits, the requirements for the wafer cleaning process are also getting higher and higher. Cleaning equipment has also developed from the initial tank cleaning to more complex and precise single-chip cleaning. In the process of single-wafer cleaning, the rotating body of the cleaning equipment drives the wafer to rotate, and the cleaning liquid or ultrapure water on the surface of the wafer can be thrown out for recycling or discharge. [0003] Generally speaking, a liquid collecting structure is arranged around the rotating body of the cleaning device. When the cleaning medium is thrown from the surface of the wafer under the action of rotating centrifugal force and touches the side wall of the liquid collection s...

AI Technical Summary

Problems solved by technology

In this process, due to the high kinetic energy of the liquid particles thrown out at high speed, when they hit the side wall of the liquid collection structure, they may rebound, causing chemical reagents and cleaning products to splash back to the edge of the wafer. even the backside of the wafer, causing contamination

If this pollution cannot be removed in time, it will cause defects on the edge and back of the wafer, especially in the subsequent high-temperature processing process, which will cause the contamination on the edge and back of the wafer to spread to the front, seriously affecting the quality of the wafer

On the other hand, the splash back of the liquid cleaning medium will also cause waste of liquid medicine and increase production costs

[0004] In the existing technology, there is currently no method that can effectively prevent the liquid cleaning medium from splashing back, so that the quality of the wafer cannot be further improved

Images