Sand plating solution device on diamond cutting line

Abstract

The invention discloses a sanding and solution plating device for a diamond cutting wire and belongs to the technical field of production equipment for diamond cutting wires. The sanding and solution plating device for the diamond cutting wire comprise a liquid accumulation box. A wire guiding wheel is arranged on one side wall of the liquid accumulation box. A V-shaped groove allowing the diamond cutting wire to penetrate through is formed in the wire guiding wheel. A cleaning device is arranged on one side wall of the liquid accumulation box. The tail end of the cleaning device makes contact with the inner wall of the V-shaped groove. The sanding and solution plating device for the diamond cutting wire is simple in structure and practical; when crystals are generated in the V-shaped groove, the crystals can be removed in time through a scraper plate, so that the bottom of the V-shaped groove is kept clean, and the problem that the diamond cutting wire cannot be centered due to the crystals at the bottom of the V-shaped groove of the wire guiding wheel is solved; meanwhile, the problem that sanding of the diamond cutting wire is uneven due to the fact that the diamond cutting wire cannot be centered is solved, product quality is improved, working efficiency is improved, and production cost is reduced.

Description

technical field [0001] The invention belongs to the technical field of diamond cutting wire production equipment, and in particular relates to a sand plating solution device for a diamond cutting wire. Background technique [0002] As the cutting process of diamond cutting wire on hard and brittle materials such as single crystal silicon and sapphire is becoming more and more popular, the requirements for the equipment for producing diamond cutting wire are getting higher and higher. The rationality and stability of the equipment are very important for the production of diamond cutting wire. The manufacturability and whether it can run stably and continuously for a long time have a great influence. [0003] At present, in the process of producing diamond cutting wire equipment, due to the use of electroplating method, during the electroplating process, due to long-term contact between the V-shaped groove inner wall of the lead wheel and the diamond cutting wire, the V-shaped...

AI Technical Summary

Problems solved by technology

[0003] At present, in the process of producing diamond cutting wire equipment, due to the use of electroplating method, during the electroplating process, due to long-term contact between the V-shaped groove inner wall of the lead wheel and the diamond cutting wire, the V-shaped groove (the contact surface Position) will produce a small amount of crystallization phenomenon. When the crystallization is not firmly bonded to the V-shaped groove of the lead wheel, the crystallization can be removed with a little force during the working process, but the longer the working time, the more crystallization will be. The bonding with the V-groove of the lead wheel is also more firm, resulting in the inability to center during the sanding process on the diamond line; in addition, at the initial stage of sanding, the bottom of the V-groove of the lead wheel is centered with the outlet hole on the effusion tank, but the work After a period of time, due to the high working temperature and the PP material of the effusion tank, it is easy to deform, so that the bottom of the V-shaped groove of the lead wheel and the center of the upper cover hole of the effusion tank will be offset, which will affect the diamond cutting line. Sand effect, high waste wire rate, which affects product quality and reduces work efficiency. Severe crystallization makes the lead wheel scrapped and increases production costs.

Images