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LED package-free structure and package-free method thereof

A packaging structure and packaging method technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of LED chip failure, affecting LED life, etc., and achieve the effects of improving reliability, overcoming phosphor aging, and avoiding heat accumulation

Inactive Publication Date: 2015-12-23
SOUTH CHINA UNIV OF TECH +1
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Problems solved by technology

[0009] In view of the deficiencies in the above-mentioned prior art, the purpose of the present invention is to provide users with an LED package-free structure and its package-free method, which overcomes the problem of solder beads doping with impurities or LED chip current in the prior art LED package-free structure. If it is too large, the defects that lead to the failure of the LED chip, and the ultraviolet light will enter the phosphor layer from the side wall upwards, seriously affect the defects of the life of the LED

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  • LED package-free structure and package-free method thereof
  • LED package-free structure and package-free method thereof
  • LED package-free structure and package-free method thereof

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[0033] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0034] In order to overcome such as figure 1 In the LED package-free structure shown in the prior art, since the heat of the tin ball part cannot be dissipated, heat accumulation occurs, which causes the chip to burn and the circuit to be disconnected, resulting in the defect of LED failure, and the fluorescent layer is affected by ultraviolet light. To solve the problem of accelerated aging, the present invention provides a high-reliability LED package-free structure.

[0035] Such as figure 2 As shown, the LED package-free structure provided by the present invention includes: a subs...

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Abstract

The invention provides an LED package-free structure and a package-free method thereof. Grooves corresponding to the position of an LED chip are arranged on a substrate, electrodes of the LED chip are accommodated in the grooves, a circuit of a circuit layer on the substrate is accessed through soldering tin in the grooves, and connection with the electrodes is established through groove structures, such that the problem of heat accumulation of tin beads in a conventional package-free structure is solved, and the reliability of an LED is greatly improved. Besides, an ultraviolet light conversion layer is also utilized for converting ultraviolet light in the LED chip into blue light so that the defect of acceleration of aging of fluorescent powder in a fluorescent powder layer is overcome.

Description

technical field [0001] The invention relates to the field of manufacturing liquid crystal display devices, in particular to an LED package-free structure and a package-free method. Background technique [0002] At present, with the improvement of LED power and luminous efficiency, LED products featuring energy saving, fast response, small size, and high luminous efficiency are widely used in the fields of display product backlight and general lighting, and occupy an increasing market share. The market space is considered to be the best light source for the new generation of green energy-saving lighting. [0003] The traditional surface mount package LED (SMDLED) packaging structure is to place the LED chip in a plastic bracket through processes such as solid crystal and wire bonding, and then coat the phosphor powder on the top of the LED chip through the packaging glue to achieve electrical interconnection. and chip protection. In addition, the packaged LED surface can be...

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Application Information

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IPC IPC(8): H01L33/48H01L33/62H01L33/50
CPCH01L33/483H01L33/504H01L33/62H01L2933/0033H01L2933/0041H01L2933/0066
Inventor 周忠伟孟长军
Owner SOUTH CHINA UNIV OF TECH
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