LED package-free structure and package-free method thereof

Abstract

The invention provides an LED package-free structure and a package-free method thereof. Grooves corresponding to the position of an LED chip are arranged on a substrate, electrodes of the LED chip are accommodated in the grooves, a circuit of a circuit layer on the substrate is accessed through soldering tin in the grooves, and connection with the electrodes is established through groove structures, such that the problem of heat accumulation of tin beads in a conventional package-free structure is solved, and the reliability of an LED is greatly improved. Besides, an ultraviolet light conversion layer is also utilized for converting ultraviolet light in the LED chip into blue light so that the defect of acceleration of aging of fluorescent powder in a fluorescent powder layer is overcome.

Description

technical field [0001] The invention relates to the field of manufacturing liquid crystal display devices, in particular to an LED package-free structure and a package-free method. Background technique [0002] At present, with the improvement of LED power and luminous efficiency, LED products featuring energy saving, fast response, small size, and high luminous efficiency are widely used in the fields of display product backlight and general lighting, and occupy an increasing market share. The market space is considered to be the best light source for the new generation of green energy-saving lighting. [0003] The traditional surface mount package LED (SMDLED) packaging structure is to place the LED chip in a plastic bracket through processes such as solid crystal and wire bonding, and then coat the phosphor powder on the top of the LED chip through the packaging glue to achieve electrical interconnection. and chip protection. In addition, the packaged LED surface can be...

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Problems solved by technology

[0009] In view of the deficiencies in the above-mentioned prior art, the purpose of the present invention is to provide users with an LED package-free structure and its package-free method, which overcomes the problem of solder beads doping with impurities or LED chip current in the prior art LED package-free structure. If it is too large, the defects that lead to the failure of the LED chip, and the ultraviolet light will enter the phosphor layer from the side wall upwards, seriously affect the defects of the life of the LED

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