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Two-dimensional splicing processing method of oblique scanning lithography machine in step exposure

A technology of oblique scanning and processing method, applied in the field of step-by-step exposure control of oblique scanning lithography machine, can solve problems such as two-dimensional splicing, and achieve the effect of improving quality and good splicing effect

Active Publication Date: 2017-10-10
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0005] The object of the present invention is to provide a two-dimensional splicing processing method for an oblique scanning lithography machine during step exposure, so as to solve the problem of two-dimensional splicing when an oblique scanning lithography machine uses a monochrome bitmap for step exposure. stitching problem

Method used

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  • Two-dimensional splicing processing method of oblique scanning lithography machine in step exposure
  • Two-dimensional splicing processing method of oblique scanning lithography machine in step exposure
  • Two-dimensional splicing processing method of oblique scanning lithography machine in step exposure

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0033] A method for two-dimensional splicing processing of an oblique scanning photolithography machine during stepping exposure, comprising the following steps:

[0034] S1. Calculate the size of the monochrome bitmap for each split of the graphics to be exposed according to the size of the field of view of the graphics generator and the angle between the graphics generator and the precision motion platform, such as figure 1 , figure 2 Shown:

[0035] Ws=(W-H*tanα)cosα

[0036]

[0037] Among them, Ws represents the width of the monochrome bitmap for each split of the graphics to be exposed, Hs represents the height of the monochrome bitmap for each split of the graphics to be exposed, W represents the width of the field of view of the pattern generator, and H represents the field of view of the pattern generator Height, α represents th...

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Abstract

The present invention provides a two-dimensional splicing processing method of an oblique scanning photolithography machine during step-by-step exposure, which includes calculating the size of the monochrome bitmap for each split of the graphics to be exposed; splitting the graphics to be exposed into several Monochrome bitmap, the insufficient part is filled with black image; rotate the monochrome bitmap and expand it to the size of the image generator field of view; move the precision motion platform to complete the exposure line by line. The invention solves the problem that the splicing part of the inclined scanning lithography machine cannot be spliced ​​normally during the step-by-step exposure process. When the exposure pattern is split, the exposure pattern is transformed according to the fixed angle between the pattern generator and the precision motion platform. , by controlling the precision motion platform to combine each monochrome bitmap into a complete exposure pattern, so that the final etched pattern can achieve a good splicing effect at all splicing positions, thereby improving the stepping speed of the oblique scanning lithography machine the quality of exposure.

Description

technical field [0001] The invention relates to the technical field of step exposure control of an oblique scanning lithography machine, in particular to a two-dimensional splicing processing method for an oblique scanning lithography machine during step exposure. Background technique [0002] Photolithography is used to print a pattern of features on the surface of a substrate. Such substrates may include chips used in the fabrication of semiconductor devices, various integrated circuits, flat panel displays (eg, liquid crystal displays), circuit boards, biochips, micromechanical electronic chips, optoelectronic circuit chips, and the like. [0003] The oblique scanning lithography technology adds key indicators such as equipment operation capacity and line width accuracy to the original lithography technology, but for some special needs, it still performs step-by-step exposure on some graphics, such as Barcode, serial number, etc. In the step-by-step exposure process, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
Inventor 陆敏婷
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
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