Grinding process for container for high-purity ultra-pure electronic chemical product

Abstract

The invention provides a grinding process for a container for a high-purity ultra-pure electronic chemical product and solves the following technical problems that the finish degree of polished inner walls is low and not quite uniform relatively, particles and metal ions of the polished inner walls are high in attaching ratio and difficult to completely remove, and therefore product qualities are poor in existing shot blasting polishing processes. The grinding process for the container for the high-purity ultra-pure electronic chemical product includes the following steps of (1) preparation of the container to be ground, (2) rough grinding, (3) primary cleaning, (4) primary blow drying, (5) fine grinding, (6) secondary cleaning and (7) secondary blow drying. The grinding process for the container for the high-purity ultra-pure electronic chemical product has the advantage of a high finish degree of the inner walls.

Description

technical field [0001] The invention relates to a grinding process, in particular to a grinding process for high-purity and ultra-pure electronic chemical containers. Background technique [0002] With the upgrading of semiconductor products, especially the production of semiconductor products below 28NM, the integrated circuit industry has higher and higher requirements for the purity and harmful impurities of electronic materials, especially electronic chemicals. Electronic materials rely on imports With the support of the state, many of them have been localized, and the scale of high-purity and ultra-high-purity electronic chemicals is not only a simple purification production, but also must rely on packaging, storage, and transportation The packaging of high-purity and ultra-pure electronic chemicals is the short board in the large-scale production of domestic electronic materials, and its various high-purity chemical packaging containers can only rely on foreign imports...

AI Technical Summary

Problems solved by technology

[0003] At present, the inner wall treatment technology used at home and abroad basically adopts the process of shot blasting and grinding. This treatment method has the following problems: 1. The smoothness of the inner wall after grinding is relatively low (generally around 0.3S), and the smoothness of the inner wall is relatively insufficient. Uniform; 2. After grinding, the adhesion rate of inner wall particles and metal ions is high, and such substances are difficult to completely remove, resulting in poor product quality

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