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A kind of manufacturing method of metallized ceramic substrate

A technology for metallized ceramics and a manufacturing method, which is applied to coatings, devices for coating liquid on surfaces, etc., can solve the problems of metal slurry overflowing the edge of ceramic substrates, reducing the production quality of ceramic substrates, and being unable to meet the production capacity needs of enterprises. Achieve the effect of shortening the production cycle, good practical performance, and reducing the cost of coating

Active Publication Date: 2022-05-24
浙江蔚蓝航盾精密陶瓷科技有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0006] The present invention can solve the following problems that ceramic substrates may encounter in the process of smearing metal paste: a. The metal paste is manually applied to the surface of the ceramic substrate, which requires more manpower and labor intensity Larger, resulting in low smearing efficiency and unable to meet the production capacity needs of the enterprise; b. Incomplete smearing or metal slurry overflowing the edge of the ceramic substrate is prone to occur during the manual smearing process, resulting in a greater smearing effect, thereby reducing the production of the ceramic substrate quality

Method used

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  • A kind of manufacturing method of metallized ceramic substrate
  • A kind of manufacturing method of metallized ceramic substrate
  • A kind of manufacturing method of metallized ceramic substrate

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Embodiment Construction

[0039] Embodiments of the present invention will be described below with reference to the drawings. In the process, in order to ensure the clarity and convenience of illustration, we may exaggerate the width of the lines or the size of the constituent elements in the diagram.

[0040] In addition, the following terms are defined based on the functions in the present invention, and may be different according to the user's or operator's intention or practice. Therefore, these terms are defined based on the entire content of this specification.

[0041] like Figure 1 to Figure 10 As shown, a metallized ceramic substrate manufacturing method, which uses a metallized ceramic substrate manufacturing equipment, the metallized ceramic substrate manufacturing equipment includes a bottom plate 1, a conveying device 2, a fixing device 3, a feeding device 4 and a smoothing Device 5, the specific method when using the above-mentioned metallized ceramic substrate manufacturing equipment ...

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Abstract

The invention relates to a method for manufacturing a metallized ceramic substrate, which comprises a base plate, a conveying device, a fixing device, a feeding device and a smoothing device. The upper end of the base plate is provided with a conveying device. The outer side of the device is provided with a feeding device, and the rear of the feeding device is provided with a smoothing device. The present invention can solve the following problems that the existing ceramic substrate may encounter in the process of applying the metal slurry: a. Manually apply the metal slurry to the surface of the ceramic substrate, which requires more manpower, And the labor intensity is high, which leads to low application efficiency and cannot meet the production capacity needs of the enterprise; b. Incomplete application or metal slurry overflowing the edge of the ceramic substrate is prone to occur in the manual application process, resulting in a large application effect, thereby reducing the ceramic substrate. Substrate production quality.

Description

technical field [0001] The invention relates to the field of manufacturing ceramic substrates, in particular to a method for manufacturing metallized ceramic substrates. Background technique [0002] Ceramic substrate refers to a special process board made of metal foil directly bonded to the surface of a ceramic substrate at high temperature. The side ceramic substrate manufactured in this way has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and has a large current-carrying capacity. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. [0003] Since the surface structure of ceramic substrate materials is different from that of metal materials, welding often cannot wet the ceramic surface, nor can it act with it to form a firm bond. Therefore, the sealing of ceramics and metals is a special proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C11/02B05C11/10B05C13/02B05D7/24C04B41/88
CPCB05C5/0212B05C13/02B05C11/023B05C11/1039B05D7/24C04B41/88C04B41/51B05D2203/30C04B41/4539
Inventor 王亓会
Owner 浙江蔚蓝航盾精密陶瓷科技有限公司
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