Three-dimensional integrated inductor and manufacturing method thereof
An integrated inductance, three-dimensional technology, used in semiconductor/solid-state device manufacturing, electric solid-state devices, circuits, etc., can solve the problem of small inductance value of integrated inductors, and achieve the effect of increasing inductance value
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[0031] Such as figure 1 As shown, a three-dimensional integrated inductor includes a top layer dielectric 101, a top layer interlayer dielectric 201, a semiconductor substrate 301, and a bottom layer dielectric 401. Spiral through-silicon holes are etched on the semiconductor substrate 301, and the through-silicon holes An insulating layer 302 is disposed on the inner surface of the insulating layer 302, a metal 303 is disposed inside the insulating layer 302, a top interlayer dielectric 201 is disposed on the upper surface of the semiconductor substrate 301, and the first contact hole and the second contact hole are etched in the top interlayer dielectric 201. Two contact holes, the first contact hole and the second contact hole are located on the metal 303, the first contact hole is filled with the first interconnection metal plug 202, the second contact hole is filled with the second interconnection metal plug 203, and The top layer interlayer dielectric 201 is provided wit...
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