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Etching tape for manufacturing touch screen and preparation method and etching method thereof

A technology of touch screen and adhesive tape, which is applied to the removal of conductive materials by chemical/electrolytic methods, chemical instruments and methods, adhesives, etc., which can solve the problems of low production line utilization rate, high production cost, waste of etching paste, etc., and achieve improvement Product yield, reduce production cost, eliminate the effect of manpower waste

Inactive Publication Date: 2019-03-15
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Embodiments of the present invention provide an etching tape for manufacturing touch screens, a preparation method thereof, and an etching method, which solve the problems of waste of etching paste, high production cost, non-environmental protection, and low production line utilization rate in the existing etching method. question

Method used

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  • Etching tape for manufacturing touch screen and preparation method and etching method thereof
  • Etching tape for manufacturing touch screen and preparation method and etching method thereof
  • Etching tape for manufacturing touch screen and preparation method and etching method thereof

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preparation example Construction

[0035] This embodiment also provides a method for preparing the above-mentioned etching tape for touch screen manufacture, comprising: coating a material including etching paste on the first region 12a corresponding to the region to be etched on the substrate 11; The second area 12b outside the area 12a is left blank, or coated with an adhesive material. This embodiment provides a method for preparing the above-mentioned adhesive tape for etching, which can be produced by using existing coating equipment, and the preparation method is simple and the cost is low.

[0036] Specifically, the above-mentioned adhesive tape is attached to the area to be etched, so that the first area 12a of the adhesive tape corresponds to the area to be etched, and the adhesive tape is torn off after a preset time; , rinse with pure water or use other methods to clean. The etching method also provided by this embodiment uses any one of the adhesive tapes, which has high etching precision, saves et...

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Abstract

The invention discloses an etching tape used in the manufacture of touch screens, a preparation method thereof, and an etching method, and relates to the field of display device manufacturing, which can solve the problems of waste of etching paste, high production cost, non-environmental protection, and production line problems caused by the existing etching method. The problem of low utilization rate. The adhesive tape for etching of the present invention includes a base material and a functional layer disposed on the base material, the functional layer includes: a first area corresponding to the area to be etched, and formed of a material including etching paste. The etching tape used for manufacturing touch screens, its preparation method and etching method provided by the invention are used to improve the etching method.

Description

technical field [0001] The invention relates to the display field, in particular to an etching tape used for manufacturing a touch screen, a preparation method thereof, and an etching method. Background technique [0002] As a special computer peripheral, touch screen is currently the simplest, most convenient and natural way of human-computer interaction; it endows multimedia with a new look and is an attractive new multimedia interactive device. [0003] At present, when major manufacturers produce touch screens, they will coat the entire layer of silicon dioxide and silicon oxynitride on the ITO (Indium Tin Oxide) surface to achieve the functions of shadow elimination, insulation and protection. Before laminating a flexible printed circuit (FPC), the silicon oxynitride layer in the area where the FPC is bonded (ie, the bonding area / bonding area) needs to be removed. However, the removal method currently used by most manufacturers is to mix the etching paste ink evenly an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/20
CPCG06F3/041C08K2201/014C09J2203/318H05K3/06G06F2203/04103C09J7/20C09J9/00C09K13/08C09J2301/204C09J2301/408C23F1/02C09K13/06C09K13/04C23F1/10C04B41/5353C04B41/91H05K1/09
Inventor 王静谢晓冬何敏张明
Owner BOE TECH GRP CO LTD