Solution for preventing bridging of electroless metal coat, and method for manufacturing printed wiring board using same
A technology of printed wiring board and electrolytic metal, which is applied in metal material coating process, liquid chemical plating, coating, etc., can solve problems such as inability to prevent bridging, and achieve the effect of non-insulation reliability and corrosion inhibition
Inactive Publication Date: 2016-01-20
JCU CORP
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0006] However, in these technologies, it is impossible to prevent bridging for the current high-density wiring pattern of column / space (L / S) = 15 / 15μm
Method used
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Effect test
Embodiment 1
[0090] Preparation of bridging preventive fluid:
[0091] An aqueous solution containing 2 g / L of 1,2-ethanedithiol and 100 g / L of ethanol was prepared, and this was used as a bridge preventing solution.
Embodiment 2
[0093] Preparation of bridging preventive fluid:
[0094] An aqueous solution containing 2 g / L of 1,8-octanedithiol and 100 g / L of ethanol was prepared, and this was used as a bridging preventing solution.
Embodiment 3
[0096] Preparation of bridging preventive fluid:
[0097] An aqueous solution containing 2 g / L of 3,6-dioxa-1,8-octanedithiol and 100 g / L of ethanol was prepared and used as a bridging preventing solution.
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A solution for preventing the occurrence of bridging of an electroless metal coat, which can prevent the occurrence of bridging, i.e., the deposition of an electroless metal coat on a resin in a wiring substrate, after the formation of a circuit pattern, said solution being characterized by comprising a polythiol compound; and a method for manufacturing a printed wiring board using the solution.
Description
technical field [0001] The present invention relates to a method for preventing the deposition of electroless metal plating on a resin surface that does not require plating when electroless metal plating is performed on a copper circuit pattern on a printed wiring board during the manufacture of a printed wiring board. Bridging prevention liquid, and the manufacturing method of the printed wiring board using the same. Background technique [0002] In the manufacturing process of printed wiring boards, for example, when forming a circuit on a laminated resin, a metal deposition catalyst such as a palladium catalyst is attached to the entire surface of the resin substrate, and electroless copper plating is applied, and further After electroplating copper to form a 10-20 μm copper layer, a resist is used to etch unnecessary copper film to form a circuit. In addition, in many cases, in the final process of manufacturing printed wiring boards, electroless nickel plating is usual...
Claims
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IPC IPC(8): C23C18/20
CPCC23C18/1653C23C18/1844
Inventor 谷本树一石川久美子
Owner JCU CORP