In-line curing device for tape carrier packaging and film-on-chip packaging

A film-on-chip packaging and tape-carrying packaging technology, which is applied in the fields of electrical solid device, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device components, etc. The effect of shortening process time, preventing discoloration defects, and improving work convenience

Active Publication Date: 2018-07-17
STECO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since the cured aluminum coil is used during the heating and aging process, the operator may cause abnormalities in the tendons and bones when repeatedly moving the cured aluminum coil to the oven.
In particular, when curing is carried out in a state where the mold PI and the product are wound together, problems of dents and poor adsorption may also occur due to contact between the product and the mold PI

Method used

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  • In-line curing device for tape carrier packaging and film-on-chip packaging
  • In-line curing device for tape carrier packaging and film-on-chip packaging
  • In-line curing device for tape carrier packaging and film-on-chip packaging

Examples

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Embodiment Construction

[0027] Hereinafter, an in-line curing device for TCP and COF packages according to the present embodiment will be described with reference to the drawings. The drawings illustrate examples of the present invention, and are provided for explaining the present invention in more detail, and do not limit the technical scope of the present invention.

[0028] In addition, the same reference numerals are assigned to the same or corresponding structural elements regardless of the figure numbers, and repeated descriptions are omitted, and the size and shape of each illustrated structural member may be enlarged or reduced for convenience of description.

[0029] In addition, terms including serial numbers such as first or second can be used to describe various structural elements, but the above structural elements are not limited to the above terms, and the above terms are only for the purpose of distinguishing one structural element from other structural elements.

[0030] figure 1 S...

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PUM

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Abstract

The invention relates to a direct insertion type curing apparatus for tape carrier packages and chip-on-film (COF) packages. According to the first embodiment of the invention, the direct insertion type curing apparatus for COF packages comprises a pouring unit used for coating the liquid resin on the surface of a chip; a pre-curing oven for primarily curing the coated resin, an unloader for winding a bonded tape together with a finished foam tape on a roll so as to protect a bonding site; and a curing unit arranged between the pre-curing oven and the unloader and used for curing the resin composed of high-heat-resistance high molecular materials at a fixed temperature. In this way, a tape carrier is prevented from deforming during the automated bonding and packaging process and the electrostatic phenomenon is avoided. The curing unit, the pre-curing oven and the unloader are connected in the direct insertion manner.

Description

technical field [0001] The invention relates to a curing device for TCP (Tape Carrier Package) and COF (Chip On Film) packaging. Background technique [0002] The present invention relates to a device used in the manufacture of a tape automated bonding package (Tape Automated Bonding package). The curing (Pre-cure) process and the oven curing (Oven cure) process, and removed the rewinding (rewind) process and marking (marking) process of the transformation of the carrier tape automatic bonding package baking device. [0003] Tape Automated Bonding packaging is usually a packaging method for mounting semiconductor components on a Tape Automated Bonding tape (Tape Automated Bonding tape) with a driver IC (Integrated Circuit) chip of a Liquid Crystal Display (LCD: Liquid Crystal Display). It is equivalent to TCP (Tape Carrier Package: Tape Carrier Package), COF (Chip On Film: Chip On Film), etc. [0004] The manufacturing process of this tape-carrying automatic bonding packag...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L21/67
CPCH01L21/56H01L21/67098H01L21/67132H01L23/49524H01L24/79
Inventor 孙正赞
Owner STECO
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