Packaging structure of semiconductor light emitting device based on transparent substrate

Abstract

The present invention discloses a semiconductor luminescent device package structure on the basis of a transparent substrate. The semiconductor luminescent device package structure provided by the invention comprises the transparent substrate, at least one semiconductor luminescent chip installed at the first surface of the transparent substrate, and a reflection mechanism installed on the transparent substrate and composed of thermal conductivity materials. The reflection mechanism includes one or more protuberance portions, one end of each protuberance portion extends into the transparent substrate, one end of at least one protuberance portion is close to a corresponding semiconductor luminescent chip, and the partial surface of each protuberance portion at least has a reflection structure used for reflect a light out of the transparent substrate, wherein the light is incident to the transparent substrate by the semiconductor luminescent chips. According to the invention, the semiconductor luminescent device package structure on the basis of a transparent substrate is characterized in that: the luminous efficiency of a device may be effectively improved, and the heat conduction way of the device may be effectively shortened so that the heat generated by the device in the working operation may be quickly and effectively transferred, therefore the working stability of the device may be ensured and the working life may be prolonged.

Description

technical field [0001] The invention relates to a semiconductor light emitting device, in particular to a semiconductor light emitting device packaging structure based on a transparent substrate. Background technique [0002] With the advent of ultra-bright LEDs, their efficiency is getting higher and higher, and their prices are gradually falling. At the same time, LED has the characteristics of long life, shock resistance, high luminous efficiency, no interference, no fear of low temperature, no mercury pollution and high cost performance. It is a great potential product that is favored by the semiconductor industry to replace traditional lighting appliances. Ultra-high-brightness LEDs have greatly expanded the application of LEDs in various signal display and lighting source fields, such as interior and exterior lights of automobiles, various traffic lights, indoor and outdoor information displays and backlights. Using LED products for lighting will provide a wider appli...

AI Technical Summary

Problems solved by technology

[0003] However, the performance of current LED devices, especially the light extraction efficiency of LED chips, needs to be improved

Theoretically, the luminous efficiency of using blue LEDs to excite yellow phosphors to synthesize white light is as high as 300 lumens per watt, but the current actual efficiency is only about half of the theoretical value. One of the important reasons is that part of the light emitted from the active area is due to The absorption and shading of the packaging material prevents it from emitting from the device, which causes a great loss of LED light efficiency

Although the industry has proposed a variety of solutions aimed at improving the light extraction efficiency of the device, for example, adding reflective films to the device, etc., these solutions will also bring other problems, such as reducing the heat dissipation performance of the device, etc.

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