Electronic substrate heat radiation structure
A heat dissipation structure and electronic substrate technology, which is applied to printed circuit components, cooling/ventilation/heating transformation, etc., can solve problems such as easy accumulation of heat, poor heat dissipation effect, and inability to dissipate heat from heat conduction plates, so as to improve heat dissipation efficiency and save effect of space
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[0079] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the embodiments of the accompanying drawings.
[0080] The present invention provides an electronic substrate heat dissipation structure, please refer to figure 1 , figure 2 , image 3 , is a schematic diagram of decomposition, assembly and cross-section of the first embodiment of the present invention; the electronic substrate cooling structure 1 includes a substrate 10 and at least one heat pipe 12, and the substrate 10 is printed circuit board (Printed Circuit Board, PCB) in this embodiment ) for illustration, but not limited thereto; and the substrate 10 includes a wiring layer 101, a ground layer 102 and an insulating layer 103, the wiring layer 101 has a first end surface 1011 and an opposite of the first end surface 1011 The second end surface 1012 and an accommodating hole 1014, the second end surface 1012 is attached (or paste...
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