Electronic substrate heat radiation structure

A heat dissipation structure and electronic substrate technology, which is applied to printed circuit components, cooling/ventilation/heating transformation, etc., can solve problems such as easy accumulation of heat, poor heat dissipation effect, and inability to dissipate heat from heat conduction plates, so as to improve heat dissipation efficiency and save effect of space

Active Publication Date: 2016-01-27
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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Problems solved by technology

Although it is known that hand-held mobile devices achieve heat dissipation effect by attaching heat-generating elements to the heat-conducting plate, the heat-dissipating effect is obviously not good, because the known heat-conducting plate is attached to the heating element, which will easily accumulate heat near the heat-conducting plate and generate heat The local position of the component (i.e. the high-temperature area), that is, the heat is easy to accumulate around the heating element, and thus cannot effectively dissipate heat through the entire heat conduction plate, resulting in poor heat dissipation

Method used

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  • Electronic substrate heat radiation structure
  • Electronic substrate heat radiation structure
  • Electronic substrate heat radiation structure

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Embodiment Construction

[0079] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the embodiments of the accompanying drawings.

[0080] The present invention provides an electronic substrate heat dissipation structure, please refer to figure 1 , figure 2 , image 3 , is a schematic diagram of decomposition, assembly and cross-section of the first embodiment of the present invention; the electronic substrate cooling structure 1 includes a substrate 10 and at least one heat pipe 12, and the substrate 10 is printed circuit board (Printed Circuit Board, PCB) in this embodiment ) for illustration, but not limited thereto; and the substrate 10 includes a wiring layer 101, a ground layer 102 and an insulating layer 103, the wiring layer 101 has a first end surface 1011 and an opposite of the first end surface 1011 The second end surface 1012 and an accommodating hole 1014, the second end surface 1012 is attached (or paste...

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Abstract

Disclosed is an electronic substrate heat radiation structure. The structure comprises a substrate and at least a heat pipe. The substrate comprises a wiring layer, an insulation layer and a grounding layer disposed between the wiring layer and the insulation layer. The wiring layer is provided with at least a heating element. The wiring layer is provided with a storing hole used for embedding the heat pipe. The heat pipe is used for absorbing heat generated by the heating element in the substrate high temperature area, and transmitting the heat to the substrate low temperature area away from the heating element for heat radiation. Thus, temperature balancing is achieved and heat radiation efficiency is improved.

Description

【Technical field】 [0001] The invention relates to an electronic substrate, in particular to an electronic substrate heat dissipation structure capable of improving heat dissipation efficiency and saving space. 【Background technique】 [0002] As the current handheld mobile devices (such as mobile phones, tablet computers, and PDAs) advance with technology, and the user's preference for thinness and computing and performance are increasingly high, the internal components of handheld mobile devices, such as the central Components such as processors and integrated circuits will generate extremely high heat during operation due to the extremely limited space in the device or mechanism (due to the requirement of thinness) and the execution or calculation speed is too fast, so the heat of the components must be dissipated first , in order to maintain the operating efficiency and service life of the components. [0003] At present, a handheld mobile device with a heat dissipation s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K7/20
Inventor 巫俊铭
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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