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Cleaning process before alkali corrosion of grinded wafer

A technology of alkali corrosion and grinding sheet, which is applied in the field of cleaning process of abrasive sheet before alkali corrosion, which can solve problems such as loss, troubled yield rate, and large fluctuation of yield rate, and achieves the effect of stable yield rate

Inactive Publication Date: 2016-02-03
JINGHUA ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Alkali-etched P-type wafers produced by traditional processes are prone to stains, with a defect rate of 1%-30%, and the yield rate fluctuates greatly, causing great troubles and yield loss to normal production
Such a result causes the high cost of the manufacturer and serious waste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The present invention is described in detail below:

[0018] The cleaning process before the corrosion of the abrasive sheet alkali includes the following steps in turn:

[0019] A. Remove the chemical liquid on the surface of the wafer after grinding with water. This step can be realized by washing with water or immersing in water.

[0020] B. Remove metal ions and organic matter on the surface of the wafer. In this step, hydrogen peroxide and ammonia water are used to remove metal ions and organic matter on the wafer surface. The metal ions and organic matter on the surface of the wafer are removed by successively using hydrogen peroxide and ammonia water or a mixture of hydrogen peroxide and ammonia water. Its dosage can be determined according to the amount of metal ions and organic matter.

[0021] C. Remove the chemical liquid on the surface of the wafer with water; this step can be realized by washing with water or immersing in water.

[0022] D. Place it in...

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PUM

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Abstract

The invention discloses a cleaning process before alkali corrosion of a grinded wafer. The cleaning process is characterized in that the cleaning process comprises the following steps: A) clearing away chemical liquid on the surface of the grinded wafer with water; B) clearing away metal ions and organic matters on the surface of the wafer; C) clearing away the chemical liquid on the surface of the wafer with water; D) placing the wafer in a cleaning agent solution for ultrasonic cleaning for more than three times, weight concentration being 1-4%; E) clearing away the chemical liquid on the surface of the wafer with water; and F) placing the wafer into a hydrochloric acid solution for cleaning to remove grinding suspension liquid and iron ions on the surface of the grinded wafer. The cleaning process before alkali corrosion of the grinded wafer reduces defect rate of the alkali corrosion type-P <III> wafer to 0.5% and below, and the qualified rate is stable.

Description

technical field [0001] The invention relates to a cleaning process before abrasive tablet alkali corrosion. Background technique [0002] With the increasingly fierce competition in the semiconductor market, reducing energy consumption, saving costs, and improving yields have become the core of technological development. Alkali-etched P-type <111> wafers produced by traditional processes are prone to stains, with a defect rate of 1%-30%, and the yield rate fluctuates greatly, causing great troubles and yield loss to normal production. Such result causes manufacturer's cost height, and waste is serious. How to reduce the defect rate in the alkali etching process of wafers is an important technical problem urgently to be solved in this field. Contents of the invention [0003] One of the purposes of the present invention is to provide a high-yield cleaning process for abrasive chips before alkali corrosion in order to overcome the deficiencies in the prior art. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
Inventor 苟钦泽黄春峰徐新华
Owner JINGHUA ELECTRONICS MATERIAL