Heat dissipation device for electronic equipment

Abstract

The invention provides a heat dissipation device for electronic equipment. The electronic equipment comprises a circuit board, wherein the circuit board is provided with a plurality of electronic devices, and the plurality of electronic devices generate heat in operation. The heat dissipation device comprises a heat conducting bracket which is fixed on the circuit board and covers the plurality of electronic devices, and the heat conducting bracket performs heat conduction with the electronic devices so as to carry out heat dissipation on the electronic devices. The side surface, which is close to the circuit board, of the heat conducting bracket comprises a first region and a second region, wherein the first region corresponds to positions of the electronic devices whose height is not greater than a first threshold on the circuit board; and the second region corresponds to positions of the electronic devices whose height is greater than the first threshold on the circuit board, and the heat conducting bracket is sunk inwards so as to form a plurality of grooves. The heat dissipation device provided by the invention can enable heat to be transferred to the metal bracket from heat generating elements quickly and more effectively, thereby improving the heat dissipation effect.

Description

technical field [0001] The present invention relates to a heat dissipation device, and more particularly, to a heat dissipation device for electronic equipment. Background technique [0002] Existing digital products such as mobile phones have more and more cores, faster processing speeds, and more and more heat generation, and the problem of heat dissipation has become increasingly prominent. The thermal design of mobile phones has become a major problem in mobile phone design. Many mobile phone design projects add a lot of heat dissipation materials to deal with the problem of large heat generation, which increases the cost of mobile phone design projects. One of the solutions is to use a thermally conductive bracket with a thermally conductive sheet to conduct the heat of the heating device to the bracket, and rely on the good thermal conductivity of the thermally conductive bracket to make the temperature on the plane of the entire thermally conductive bracket as uniform...

AI Technical Summary

Problems solved by technology

Although this method can introduce the heat of the heat-generating device to the heat-conducting support 120 to realize local heat dissipation, the thickness of the heat-conducting support 120 in the prior art is generally relatively uniform. Therefore, in order to avoid the highest device on the printed circuit board, the heat-conducting support 120 has to be made very thin, resulting in low heat capacity of the heat conducting bracket 120 itself, and due to the large thermal resistance of the heat conducting bracket 120 for lateral heat transfer, the heat conducting bracket 120 is prone to local hot spots; in addition, for heating devices of different heights, Heat conduction sheets 140 of different thicknesses are required to transfer heat to the bracket, but the heat conduction performance of the heat conduction sheets 140 is far worse than that of the support, and thicker heat conduction sheets 140 cannot fully conduct heat from the heat-generating device

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