Tin removing device for BGA
A technology of tin removal device and drive device, which is applied in printed circuit, manufacturing tools, metal processing, etc., and can solve problems such as BGA scrapping, contact damage on the pad surface, and consumption of tin suction lines.
Active Publication Date: 2016-02-24
SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
View PDF9 Cites 12 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In this process, the worker needs to hold the tin suction wire in one hand and the soldering iron in the other hand, so the degree of automation is low
[0004] In addition, in the above-mentioned BGA maintenance procedures, the soldering iron needs to directly contact the surface of the pad together with the tin suction wire during the process of heating and removing tin, which is likely to cause fatal damage to the contacts on the surface of the pad and cause the BGA to be scrapped
Furthermore, BGA tends to be smaller in size with the development of science and technology, which makes it difficult for the above-mentioned manual operation method to meet the requirements of BGA scale for tin removal accuracy
Moreover, during the above-mentioned BGA rework process, the surface temperature of the soldering iron is uneven, the temperature stability is poor, the tin removal effect is poor, and high-temperature explosions and low-temperature soldering pads are prone to fall off.
At the same time, the above-mentioned manual maintenance method also has the defect of consuming tin suction lines
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0063] Such as figure 1 , a tin removal device for BGA, comprising a tin removal mechanism 10 , a first material pulling mechanism 20 , a feeding mechanism 30 , a second material pulling mechanism 50 , and a storage mechanism 80 .
[0064] combine Figure 4 , Figure 5 , the tin removal mechanism 10 includes a pair of frame plates 12 arranged left and right, a crossbeam 13 spanning a pair of frame plates, a processing base plate 11 fixedly installed between a pair of frame plates, and a tin removing mechanism above the processing base plate. Module 18. The pair of rack plates is provided with a Y-direction slideway, and the crossbeam is provided with an X-direction slideway. A sliding block 14 is slidably fitted on the slideway, and the tin removal module is installed on the sliding block. The left and right sides of the processing base plate are provided with positioning telescopic cylinders 15, and the piston rods of the positioning telescopic cylinders are provided with...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a tin removing device for a BGA. The tin removing device comprises a tin removing mechanism, a first pulling mechanism, a material supplying mechanism, a second pulling mechanism and a storing mechanism. The tin removing mechanism comprises a tin removing module. The tin removing module comprises a hot air supplying assembly and a tin suction mechanism. In actual operation, the first pulling mechanism conveys a tray loaded with a PCB to a processing bottom plate of the tin removing mechanism, and the hot air supplying assembly heats tin on the PCB through a hot air nozzle; and the tin is molten, and the tin suction assembly recovers the molten tin into a storage box through a suction nozzle. The second pulling mechanism stores the completed tray in the storing mechanism. Thus, the to-be-processed PCB on which the BGA is pasted can be automatically loaded to the tin removing mechanism, and the PCB processed by the tin removing mechanism can be automatically stored.
Description
Technical field: [0001] The invention relates to the technical field of PCB processing with a ball grid display structure, in particular to a tin removal device for BGA. Background technique: [0002] SMT (Surface Mounted Technology, Surface Mount Technology) production is currently the most popular production method in the electronics assembly industry. There are many steps in the SMT production process, and it is easy to form soldering defects such as voids, offsets, and bridges, resulting in the BGA (BallGridArray, ball array package) of SMT products that need to be repaired during production. At the same time, electronic products are also prone to BGA during use. Damaged, after-sales repair is required. [0003] At present, during the BGA maintenance process, the BGA needs to be removed from the PCB (Printed Circuit Board, printed circuit board) by means of a soldering iron, that is, the BGA is manually removed from the PCB and the removed BGA is coated with flux and pl...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): B23K1/018
CPCB23K1/018B23K2101/42
Inventor 王荣沈祺舜
Owner SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD