Copper clad laminate energy storage hydraulic pressurization forming device

Abstract

The invention provides a copper clad laminate energy storage hydraulic pressurization forming device comprising a laminating container, an energy storage container which is communicated with the laminating container via a pipeline, and a control device which is arranged at the external wall of the laminating container and used for controlling the laminating container to complete lamination operation. A pressure control device is arranged on the cover of the laminating container. The pressure control device is used for controlling the pressure value in the laminating container. The bottom part of a laminating container body is provided with a heating device. The heating device, temperature sensors and pressure sensors are electrically connected with the control device. The control device controls the heating device to heat a liquid medium and controls the pressure control device to enable the laminating container to be within an appropriate pressure range so as to complete lamination operation. After completion of lamination operation, the control device controls an energy storage container valve to discharge the liquid medium of the laminating container to the energy storage container. With application of the technical scheme, energy storage is performed by the energy storage container so that large amount of energy consumption in the copper laminate lamination production process can be saved, and thus the copper clad laminate energy storage hydraulic pressurization forming device is economical and environment-friendly.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate preparation, in particular to an energy storage hydraulic pressure forming device for copper clad laminates. Background technique [0002] Copper Clad Laminates are substrate materials used to manufacture printed circuit boards (PCBs). In the prior art, they are usually composited and hot-pressed by substrates, insulating dielectric adhesive layers and copper foils. Since the hot pressing process is completed in air or vacuum, the molding pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product. [0003] Therefore, in view of the above-mentioned defects existing in the current prior art, it is necessary to conduct research to provide a solution to solve the defects existing in the prior art. Contents of the invention [0004] In order to solve the problems ...

AI Technical Summary

Problems solved by technology

Since the hot pressing process is completed in air or vacuum, the forming pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product.

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