Method for cutting off heads and tails for squarer

A head-to-tail, open-machine technology, applied in the direction of fine work equipment, work accessories, stone processing equipment, etc., can solve the problems of inclination, inability to meet market demand, sawing skew, etc., to reduce production costs, improve product utilization, The effect of improving accuracy

Active Publication Date: 2016-03-02
江苏美科太阳能科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, all silicon wafer cutting manufacturers in China use square cutting machines for square cutting, but considering the cost of equipment procurement, most manufacturers still use knife and saw equipment to cut off the head and tail, and the existing cutting machine is in the process of cutting the head and tail. There are edge chipping and end face beveling or concave-convex surface, etc. After improvement, there are still 0.8mm / ingot chipping and 1.2mm end face inclination, which cannot meet the market demand

Method used

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  • Method for cutting off heads and tails for squarer
  • Method for cutting off heads and tails for squarer
  • Method for cutting off heads and tails for squarer

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Embodiment Construction

[0023] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0024] A method for opening the machine to cut off the head and tail, the method is:

[0025] (1) Crystal brick clamping

[0026] A special jig 1 for crystal tiles is produced. The special jig for crystal tiles includes a side plate 2 and a bottom plate 3. There are two side plates 2 and the two ends of the bottom plate 3 are connected vertically to the two side plates 2 to form an integrated structure. The side plate 2 includes a crystal tile fixing plate 4 and a mounting connecting plate 5, the crystal tile fixing plate 4 and the mounting connecting plate 5 are respectively located on both sides of the bottom plate 3, and the height of the crystal tile fixing plate 4 is H1, so The height of the mounting connecting plate 5 is H2, the H1:H2=8:3, the crystal tile fixing plate 4 is provided with a first positioning bolt 6 and a second positioning bo...

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PUM

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Abstract

The invention relates to a method for cutting off the heads and the tails for a squarer. The method includes the steps that firstly, crystal bricks are clamped; secondly, a line net is designed; and thirdly, after the crystal bricks are cut, finished crystal bricks are obtained. Special clamps for the crystal bricks are manufactured and the line net is designed on the squarer, so that the inclination distance of the end face of each finished crystal brick is reduced to 0.5 mm from 1.2 mm, the edge breaking length is controlled below 0.5 mm per ingot, and the squarer can be used for squaring crystal ingots, cutting off waste layers and removing the heads and the tails. By the adoption of the method, production cost is reduced, accuracy is improved, and the product use rate is increased.

Description

Technical field [0001] The invention relates to a method for truncating the head and tail of an open machine, and belongs to the field of solar photovoltaic silicon ingot prescription processing. Background technique [0002] Wire cutting technology is currently the most advanced silicon wafer processing technology in the world. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub hard and brittle materials such as silicon to achieve the purpose of cutting. . Compared with traditional saw blades, grinding wheel blades and internal circular cutting, wire cutting technology has the characteristics of high efficiency, high precision and low material damage. [0003] At present, all domestic silicon wafer cutting manufacturers use square-cutting machines for square-cutting, but from the perspective of equipment procurement costs, most manufacturers still use knife and saw equipment to cut the head and tail, while the exist...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/04
CPCB28D5/045B28D7/04
Inventor 朱孝吉陈董良王禄宝吴明山
Owner 江苏美科太阳能科技股份有限公司
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