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Integrated circuit chip with corrected temperature drift

An integrated circuit and chip technology, applied in the field of integrated circuit chips with corrected temperature drift, can solve the problems of wafer manufacturing cost impact, duration cannot be ignored, etc.

Active Publication Date: 2018-10-02
STMICROELECTRONICS (GRENOBLE 2) SAS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This duration cannot be neglected and has a significant impact on the total fabrication cost of the wafer compared to the total chip fabrication time

Method used

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  • Integrated circuit chip with corrected temperature drift
  • Integrated circuit chip with corrected temperature drift
  • Integrated circuit chip with corrected temperature drift

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Embodiment Construction

[0022] Here, it is desirable to perform tests of the type described above at different temperatures, while avoiding the long period of time currently required to have wafers at two different temperatures.

[0023] To this end, different topologies of integrated circuits contained in a chip are presented here. More specifically, there is provided a key element for identifying integrated circuits that can make integrated circuits sensitive to temperature changes following technology fluctuations. This critical element is concentrated in one part of the chip, which is thermally insulated from the rest of the chip. It is also provided to incorporate heating resistors and temperature sensors in this insulating part of the chip. Thus, the insulating portion of the chip, which has a small surface area compared to the total chip surface area, can be heated very quickly and tests such as those described above can be performed in a short time. As will be seen later, this short time ca...

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Abstract

The present invention relates to an integrated circuit chip with corrected temperature drift, wherein the integrated circuit chip includes a trench at least partially surrounding a critical portion of the circuit that is sensitive to temperature changes. The trenches are partially interrupted to allow circuit connections to pass between the critical portion and the exterior containing the remainder of the circuit. Critical parts include heating resistors and temperature sensors.

Description

[0001] priority [0002] This application claims priority from French Patent Application No. 1457792, filed on August 13, 2014, the entire contents of which are incorporated by reference into this application to the fullest extent permitted by law. technical field [0003] The present invention relates to chips comprising integrated circuits having one or more properties that can be changed with temperature. Background technique [0004] Certain integrated circuits, such as operational amplifiers or reference voltage generators, can experience temperature drift during their operation without some of their parameters being precisely adjusted. Even if the parameters of these circuits are calculated to avoid this drift, manufacturing fluctuating techniques that result in various circuits fabricated on the same wafer or circuits fabricated on different wafers will show technical differences, causing the circuits fabricated to experience temperature drift. [0005] An exemplar...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L27/02
CPCH01L22/14H01L23/345H01L2924/0002G01R31/2884H01L22/20H01L2924/00H01L27/0211G01K7/01
Inventor S·庞塔罗洛P·迈格
Owner STMICROELECTRONICS (GRENOBLE 2) SAS
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