Polishing device and method of sapphire wafer

A technology for sapphire wafers and polishing devices, which is applied in the direction of grinding devices, grinding/polishing equipment, grinding machine tools, etc., can solve the problems of poor flatness of the wafer surface, unstable polishing removal rate, uneven polishing liquid, etc., and achieve Reduce uneven stirring, reduce scratches and scratches, good uniformity effect

CN105382678AInactive Publication Date: 2016-03-09江苏吉星新材料有限公司
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2016-03-09
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a polishing device and method of a sapphire wafer to make an improvement on an existing technical process. The method comprises the steps of diamond polishing solution vibration treatment, magnetic stirring treatment, polishing disk face flatness measuring and finishing, nozzle connection, wafer wax pasting treatment and sapphire wafer polishing, and a vibration machine, a heating magnetic stirrer and a polishing machine which are matched with the technology are designed and improved. The quality and uniformity of the diamond polishing liquid are improved, the polishing quality of the wafer is ensured, and the polishing removing rate is stabilized; and the surface scratching of the wafer is effectively reduced, the polishing quality of the polished wafer is better, and the surface flatness of the wafer is obviously improved. TTV can be controlled within 2, meanwhile, a corresponding automatic mechanism is adopted, a worker does not need to take additional time, and labor cost of manual shaking and stirring and the phenomenon of uneven stirring are reduced.
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Description

technical field

[0001] The invention relates to the field of processing sapphire substrates, in particular to a polishing device for a sapphire wafer and a polishing method thereof. Background technique

[0002] Diamond liquid polishing is a very important process in the manufacture of sapphire wafers. It determines whether the technical parameters of TTV, LTV, and WARP after sapphire polishing meet customer needs. The general diamond polishing liquid mainly The composition is made of 80-90% alkanes and a small amount of dispersed thixotropic agents, pH regulators, surfactants, and 0.1-1% diamond differential modulation. The existing technology is applied, and the diamond in the diamond polishing liquid The micropowder is affected by gravity in the liquid, easy to precipitate, and has poor suspension. After being artificially shaken and stirred for a period of time, a part of the diamond micropowder will settle at the bottom of the container, resulting in uneven polishing li...

Examples

Embodiment Construction

[0022] A polishing device for a sapphire wafer as shown in the figure is characterized in that it includes a vibrator 1, a heating magnetic stirrer 2 and a polishing machine 3, and the vibrator 1 includes a base 4, a throwing seat 5, a motor 6, an eccentric Wheel 7 and connecting rod 8, described base 4 is provided with 4 sliding shafts 9, and described sliding shaft 9 is the linear optical axis that vertically sets, and the both sides of described throwing seat 5 fits on sliding shaft 9 , the throwing seat 5 is provided with a fixed block 10, the motor 6 is arranged in the base 4, the eccentric wheel 7 is fixedly connected with the transmission end of the motor 6, and the upper end of the connecting rod 8 is connected to one of the throwing seat 5. The side is hinged, and the lower end is hinged with the eccentric wheel 7 to realize the vertical movement of the throwing seat 5;

[0023] The heating magnetic stirrer 2 includes a stirring container 11, the stirring container 11...