Polishing device and method of sapphire wafer

Abstract

The invention provides a polishing device and method of a sapphire wafer to make an improvement on an existing technical process. The method comprises the steps of diamond polishing solution vibration treatment, magnetic stirring treatment, polishing disk face flatness measuring and finishing, nozzle connection, wafer wax pasting treatment and sapphire wafer polishing, and a vibration machine, a heating magnetic stirrer and a polishing machine which are matched with the technology are designed and improved. The quality and uniformity of the diamond polishing liquid are improved, the polishing quality of the wafer is ensured, and the polishing removing rate is stabilized; and the surface scratching of the wafer is effectively reduced, the polishing quality of the polished wafer is better, and the surface flatness of the wafer is obviously improved. TTV can be controlled within 2, meanwhile, a corresponding automatic mechanism is adopted, a worker does not need to take additional time, and labor cost of manual shaking and stirring and the phenomenon of uneven stirring are reduced.

Description

technical field [0001] The invention relates to the field of processing sapphire substrates, in particular to a polishing device for a sapphire wafer and a polishing method thereof. Background technique [0002] Diamond liquid polishing is a very important process in the manufacture of sapphire wafers. It determines whether the technical parameters of TTV, LTV, and WARP after sapphire polishing meet customer needs. The general diamond polishing liquid mainly The composition is made of 80-90% alkanes and a small amount of dispersed thixotropic agents, pH regulators, surfactants, and 0.1-1% diamond differential modulation. The existing technology is applied, and the diamond in the diamond polishing liquid The micropowder is affected by gravity in the liquid, easy to precipitate, and has poor suspension. After being artificially shaken and stirred for a period of time, a part of the diamond micropowder will settle at the bottom of the container, resulting in uneven polishing li...

AI Technical Summary

Problems solved by technology

[0002] Diamond liquid polishing is a very important process in the manufacture of sapphire wafers. It determines whether the technical parameters of TTV, LTV, and WARP after sapphire polishing meet customer needs. The general diamond polishing liquid mainly The composition is made of 80-90% alkanes and a small amount of dispersed thixotropic agents, pH regulators, surfactants, and 0.1-1% diamond differential modulation. The existing technology is applied, and the diamond in the diamond polishing liquid The micropowder is affected by gravity in the liquid, easy to precipitate, and has poor suspension. After being artificially shaken and stirred for a period of time, a part of the diamond micropowder will settle at the bottom of the container, resulting in uneven polishing liquid. The polishing removal rate is unstable, resulting in the phenomenon of wafer overgrinding and scrapping. If the precipitated large-grain diamond powder is sprayed on the surface of the polishing disc, it is easy to cause scratches and scratches on the wafer surface

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