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Photosensitive composition for preparing photosensitive cover film and preparation method and application method of photosensitive cover film for FPC

An application method and technology of covering film, applied in the field of photosensitive compositions, can solve the problems of difficulty in forming high-precision FPC, inability to precisely position, complicated production process, etc., achieve excellent adhesion and thermal fluidity, simple process, avoid process cumbersome effect

Inactive Publication Date: 2016-03-09
SUZHOU CHENGBANG DALI MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of manual bonding using the cover film will result in low position accuracy and it is difficult to form a high-precision FPC
In order to facilitate bonding, a photosensitive solder resist layer is used for the fine conductor part, but the manufacturing process is cumbersome, which will increase the cost
Therefore, the cover film used in the FPC manufacturing process of the prior art has the defects of inaccurate positioning, cumbersome process, high production cost and low production efficiency.

Method used

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  • Photosensitive composition for preparing photosensitive cover film and preparation method and application method of photosensitive cover film for FPC
  • Photosensitive composition for preparing photosensitive cover film and preparation method and application method of photosensitive cover film for FPC
  • Photosensitive composition for preparing photosensitive cover film and preparation method and application method of photosensitive cover film for FPC

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Experimental program
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Effect test

Embodiment 1

[0045] A kind of photosensitive composition that is used to prepare photosensitive cover film, it is made up of self-made polyamic acid and adhesive, in the present embodiment, the weight ratio of homemade polyamic acid and adhesive is 1: 5; Wherein, according to formula quantity After uniformly mixing the self-made polyamic acid and the adhesive, the photosensitive composition for preparing the photosensitive cover film is obtained.

[0046] Wherein, the preparation method of the self-made polyamic acid is as follows: the diamine monomer is added into the solvent, fully stirred for 0.5 h, then the dianhydride monomer is added, and after stirring for 4 h, the self-made polyamic acid is synthesized;

[0047] Wherein, the molar ratio of the diamine monomer to the dianhydride monomer is 1:1, and the diamine monomer and the dianhydride monomer together account for 5% by weight of the solvent.

[0048] In this embodiment, the diamine monomer is 4,4'-diaminodiphenyl ether, the solve...

Embodiment 2

[0060] A kind of photosensitive composition that is used to prepare photosensitive cover film, it is made up of self-made polyamic acid and adhesive agent, in the present embodiment, the weight ratio of homemade polyamic acid and adhesive agent is 1: 9; Wherein, according to formula quantity After uniformly mixing the self-made polyamic acid and the adhesive, the photosensitive composition for preparing the photosensitive cover film is obtained.

[0061] Wherein, the preparation method of the self-made polyamic acid is as follows: add the diamine monomer into the solvent, fully stir for 1 hour, then add the dianhydride monomer in 5 times, stir for 0.5 hour after adding the dianhydride monomer each time, After adding all the anhydride monomers and stirring for 3 hours, the self-made polyamic acid is synthesized;

[0062] Wherein, the molar ratio of the diamine monomer to the dianhydride monomer is 1:1, and the diamine monomer and the dianhydride monomer together account for 10%...

Embodiment 3

[0075] A kind of photosensitive composition that is used to prepare photosensitive cover film, it is made up of self-made polyamic acid and adhesive, in the present embodiment, the weight ratio of homemade polyamic acid and adhesive is 1: 7; Wherein, according to formula quantity After uniformly mixing the self-made polyamic acid and the adhesive, the photosensitive composition for preparing the photosensitive cover film is obtained.

[0076] Among them, the preparation method of the self-made polyamic acid is as follows: add the diamine monomer into the solvent, fully stir for 0.8h, then add the dianhydride monomer in three equal parts, stir for 1h after each addition of the dianhydride monomer, After adding all the anhydride monomers and then stirring for 5 hours, the self-made polyamic acid is synthesized;

[0077] Wherein, the molar ratio of the diamine monomer to the dianhydride monomer is 1:1, and the weight percentage of the diamine monomer and the dianhydride monomer i...

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Abstract

The invention relates to the technical field of chemical materials, in particular to a photosensitive composition for preparing a photosensitive cover film and a preparation method and an application method of the photosensitive cover film for an FPC. The photosensitive composition is prepared from home-made polyamide acid and an adhesive, wherein the preparation method of the home-made polyamide acid comprises the following steps: adding a diamine monomer to a solvent and stirring the diamine monomer; and adding a dianhydride monomer and stirring the dianhydride monomer to synthesize the home-made polyamide acid; the adhesive comprises acrylic resin, epoxy resin, a curing agent, a photoinitiator and a photosensitizer; and the preparation method of the photosensitive cover film for the FPC comprises the following steps: coating a first release film with the photosensitive composition to form a coating layer; and after solidifying the coating layer, covering the coating layer with a second release film, so as to prepare the photosensitive cover film for the FPC. The photosensitive cover film for the FPC can be applied to preparation of the FPC; the photosensitive cover film has the advantages of being accurate in positioning, simple in procedure, low in production cost and high in production efficiency when used for preparing the FPC.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a photosensitive composition used for preparing a photosensitive cover film and a preparation method and an application method of the photosensitive cover film for FPC. Background technique [0002] FPC, that is, flexible circuit board. In the prior art, the FPC uses a polyimide film as the cover film to protect the conductor. In the prior art, when the cover film is used to prepare the FPC, the cover film is generally stamped with a fixed mold, and then pasted by hand. combine. This method of manual lamination using the cover film will result in low position accuracy, making it difficult to form a high-precision FPC. In order to facilitate bonding, a photosensitive solder resist layer is used for the fine conductor part, but the manufacturing process is cumbersome, which will increase the cost. Therefore, the cover film used in the FPC manufacturing process of the ...

Claims

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Application Information

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IPC IPC(8): G03F7/004C08G73/10H05K3/28
CPCG03F7/004C08G73/1007H05K3/28
Inventor 闫勇高小君
Owner SUZHOU CHENGBANG DALI MATERIAL TECH