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Buffing apparatus, and substrate processing apparatus

A component and substrate technology, which is applied in the field of substrate polishing to achieve the effect of improving the polishing speed

Active Publication Date: 2016-03-09
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, in the prior art, a pad is attached to an elastic member, and the end of the elastic member is held, and a space is formed on the side of the elastic member where the pad is not attached.

Method used

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  • Buffing apparatus, and substrate processing apparatus
  • Buffing apparatus, and substrate processing apparatus
  • Buffing apparatus, and substrate processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Deformed example 1

[0415] The buffing unit 300A may include an external nozzle provided outside the buff head 500 as a processing liquid supply means in addition to the internal supply line 506 . In this case, the external nozzle may be used in addition or instead of the internal supply line 506 depending on the situation.

Deformed example 2

[0417] exist Figure 7 In the structure shown, the difference in properties between the inner pad 502a and the outer pad 502b may also be a difference in polishing performance. For example, the inner pad 502a can be determined based on the required buffing performance, and a soft buffing pad with high adhesion can be used as the outer pad 502b in order to improve the holding performance of the processing liquid. Alternatively, as the inner pad 502a, a pad having properties suitable for one of buff polishing and buff cleaning may be used, and as the outer pad 502b, a pad having properties suitable for the other may be used. According to this configuration, by selectively using one of the inner pad 502a and the outer pad 502b, buffing processing corresponding to the required quality can be performed without exchanging the buff pad. Alternatively, it is possible to perform different processes for each region of the wafer W, thereby achieving high-precision polishing. For exampl...

Deformed example 3

[0419] exist Figure 7 In the shown structure, the inner pad 502a and the outer pad 502b may not necessarily be configured to be independently controllable. That is, the inner pad 502a and the outer pad 502b do not need to be configured to be independently controllable in elevation, nor may they be configured to be independently controllable in rotation. For example, even when the inner pad 502a and the outer pad 502b are not configured to be independently liftable and controllable, the effect of holding the treatment liquid in the inner region of the outer pad 502b can be obtained. In this case, the inner pad 502a and the outer pad 502b may be raised temporarily to accelerate the discharge of the treatment liquid.

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PUM

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Abstract

A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other. The buffing apparatus can polish with reducing damage to the substrate or can efficiently wash out foreign matters with high viscidity.

Description

technical field [0001] The invention relates to a polishing treatment technology of a substrate. Background technique [0002] In semiconductor device manufacturing, a chemical mechanical polishing (CMP, Chemical Mechanical Polishing) apparatus for polishing the surface of a substrate is known. A substrate processing system equipped with a CMP apparatus includes a polishing unit (CMP unit) for polishing a substrate, a cleaning unit for cleaning and drying the substrate, and transfers the substrate to the polishing unit and receives the substrate from the cleaning unit. Loading / unloading unit for cleaning and drying substrates, etc. In the polishing unit, a polishing pad is attached to the upper surface of the polishing table to form a polishing surface. The polishing unit presses the surface to be polished of the substrate held by the top ring against the polishing surface, supplies slurry as a polishing liquid to the polishing surface, and rotates the polishing table and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67092B24B27/0023B24B37/105B24B37/26B24B37/345B24B53/017B24B57/02H01L21/67173H01L21/67178H01L21/67219B24B37/04B24B37/20B24B41/002B24B37/10
Inventor 山口都章水野稔夫小畠严贵
Owner EBARA CORP