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Preparation method of low-resistance value chip resistor

A chip resistance, low resistance technology, used in resistors, resistor manufacturing, resistor chip manufacturing, etc., can solve problems such as easy bumping, scratching product end electrodes, and low TCR level.

Active Publication Date: 2016-03-16
RALEC TECH KUNSHAN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are following deficiencies in this production method: 1. The TCR level of the product is low; said TCR refers to the temperature coefficient of resistance; Resistor element function failure
[0003] Therefore, in the current industry, there is an urgent need for a new method of preparing low-resistance chip resistors, which can not only avoid the failure of the original resistor function due to bumping into the terminal electrode during testing, but also improve the TCR level of the product.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: A preparation method of a low-resistance chip resistor, comprising the following steps:

[0031] Step C1-B: Printing the required shape and position of the front conductor on the substrate by the screen through the printing machine;

[0032] Step RS: print the required resistance shape and position on the front side of the substrate by the screen through the printing machine;

[0033] Step C1-A: Print the required front conductor shape and position in the middle of the resistor by the screen through the printing machine;

[0034] Step C3-A: Print the required C3-A conductor shape and position on the front conductor printed in the C1-A step by the screen through the printing machine;

[0035] Step G1: Printing a resistive layer protective layer on the semi-finished product after C1-A is completed by a screen printing machine, and the resistive layer protective layer covers the resistor printed in step RS;

[0036] Step LT: laser cutting the resistor to form...

Embodiment 2

[0045] Embodiment 2: The difference between this embodiment and Embodiment 1 is that in this embodiment, the printing thickness when printing the conductor in step C1-B is 25±10 μm; the printing thickness when printing the resistive layer in step RS is 25±10 μm .

Embodiment 3

[0046] Embodiment 3: The difference between this embodiment and Embodiment 1 is that in this embodiment, the printing thickness when printing the conductor in step C1-A is 25±10 μm; the printing thickness of the resistance layer protection layer in step G1 is 20±10 μm. 10 μm.

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PUM

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Abstract

The invention discloses a preparation method of low-resistance value chip resistor. The method comprises the following steps of: printing the needed front conductor shape and position on a substrate by a screen printing plate through a printing machine; printing the needed resistor shape and position on the front of the substrate by the screen printing plate through the printing machine; printing the needed front conductor shape and position in the middle of the resistor by the screen printing plate through the printing machine; printing the needed C3 conductor shape and position on a front conductor printed in the step C1, by the screen printing plate through the printing machine; executing operations, such as G1, LT, G2, MK, side silver plating, forming granular resistors by breaking off, and electroplating. Through the way above, in the method, technology is improved, reverse side printing is adopted, various manufacture procedures and processes are concentrated in reverse printing of product, thus, clients use a method of soldering tin on the reverse side of products in use, a resistor printing side is set downward during the tin soldering process, current formation is reduced, and the aim of improving TCR standard of products is realized; moreover, failure of product functions caused by crush injury of a terminal electrode is avoided, quality condition of products is improved, and production efficiency is increased.

Description

technical field [0001] The invention relates to the field of electronic component production, in particular to a method for preparing a low-resistance chip resistor. Background technique [0002] With the demand for miniaturization, high performance, high reliability, safety and electromagnetic compatibility of electronic equipment in the industrial and consumer electronics market, new requirements are constantly put forward for the performance of electronic circuits, and chip components are further developed towards miniaturization, Multi-layer, large-capacity, high-voltage resistance, integration and high-performance development. For some chip resistors, the resistance value of chip resistors is required to be low due to usage requirements. In actual production, for the production of low-resistance chip resistors, especially the production of low-resistance chip resistors below 1R, the front side printing is generally used in production, and each process process is concen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/065H01C17/00
CPCH01C17/006H01C17/065
Inventor 管春风
Owner RALEC TECH KUNSHAN LTD