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Compression molding device and production method for compression-molded article

A technology of compression molding and manufacturing method, applied in the direction of manufacturing tools, presses, material molding presses, etc., can solve the problems of powder scattering, poor handling, low filling efficiency, etc.

Inactive Publication Date: 2016-03-16
IDEMITSU KOSAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This is because the material for organic elements added to the vapor deposition source is usually in the form of powder, but if it is in the form of powder, there will be problems such as low filling efficiency, poor handling, and powder scattering

Method used

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  • Compression molding device and production method for compression-molded article
  • Compression molding device and production method for compression-molded article
  • Compression molding device and production method for compression-molded article

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0034] (1) Configuration of compression molding device

[0035] figure 1 A schematic diagram of the compression molding apparatus 1 according to this embodiment is shown in .

[0036] The compression molding apparatus 1 includes a compression molding die 2 , a first punch 3 , and a second punch 4 provided to face the first punch 3 . The compression molding device 1 further includes a base part 10, two guide posts 11 erected parallel to each other on the base part 10, an upper frame 12 connected to the upper ends of the guide posts 11, and supported between the base part 10 and the upper frame 12. The lower movable plate 13, the middle movable plate 14 and the upper movable plate 15. Such as figure 1 As shown, the lower movable plate 13 , the middle movable plate 14 , and the upper movable plate 15 are arranged parallel to each other in this order from the base portion 10 side. In addition, the lower movable plate 13 , the middle movable plate 14 , and the upper movable pla...

no. 2 approach

[0063] In the description of the second embodiment, the same symbols, names, etc. are attached to the same components as those of the first embodiment, and the description will be omitted or simplified. In addition, in the second embodiment, the same materials or compounds as those described in the first embodiment can be used.

[0064] In the first embodiment, the nitride film is formed on the first pressurizing surface 31, the second pressurizing surface 41, and the inner peripheral surface 21c. In contrast, in the second embodiment, a three-layer structure is formed. The aspect of the laminated film is different.

[0065] In this embodiment, each of the compression molding die 2 of the compression molding device 1, the inner peripheral surface 21c of the first punch 3 and the second punch 4, the first pressing surface 31, and the second pressing surface 41 are formed In the laminated film, the contact angle of water on the outermost film surface is 80 degrees or more. Als...

Embodiment 1

[0092] A powder material having an average particle diameter D50 of 20.71 μm and a bulk density of 0.33 g / ml was compression-molded by the compression-molding apparatus 1 described in the above-mentioned embodiment. The molded article hardness of the compression molded article described in Example 1 was measured. Table 1 shows the properties of the powder material and the hardness of the molded product. In addition, the average particle diameter D50 is a median diameter. The median diameter represents the particle diameter measured by the Nikkiso Co., Ltd. laser diffraction / scattering type particle size analyzer MT3300II as a cumulative distribution, and measures from this cumulative distribution.

[0093] The bulk density was measured using a pseudo-pycnometer JIS-K-5101 manufactured by Tsutsui Physical and Chemical Instruments Co., Ltd.

[0094] The molded product hardness of the compression molded product was measured by attaching a popular digital force gauge DS2-50N man...

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Abstract

The present invention provides a compression molding device comprising: a compression molding die having a through-hole and having a water contact angle in the inner circumferential surface of said through-hole of at least 80 degrees; and first and second punches each having provided therein a pressurizing surface for pressurizing a powder material by each being inserted from different through-hole entry ports of the through-hole, said punches having a water contact angle in the pressurizing surfaces of at least 80 degrees.

Description

technical field [0001] The present invention relates to a compression molding device and a method for manufacturing a compression molding body. Background technique [0002] Conventionally, a method of filling a molding chamber of a compression molding die with a powder material and compressing it with a punch is used. [0003] In addition, in recent years, methods of compression-molding powdered organic materials used in electronic devices and the like have been studied. An organic layer provided between a pair of electrodes of such an organic electronic material element is usually formed by vapor deposition under vacuum heating. This is because the material for organic elements charged into the vapor deposition source is usually in powder form, but if it is in powder form, there are problems of low filling efficiency, poor handleability, and powder scattering. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Korean Patent Publication ...

Claims

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Application Information

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IPC IPC(8): B30B11/02B29C43/02B29C43/36B30B11/00
CPCB29C33/38B29C43/006B29C43/361B29C2043/3628B30B11/022B30B15/0017B30B15/022B30B15/065
Inventor 重久大麿福田雅彦
Owner IDEMITSU KOSAN CO LTD