Mounter with anti-stacking function

Abstract

The invention discloses a placement machine with anti-stacking function, which comprises a frame accommodating box, a transmission track, a placement head and an anti-stacking frame detection mechanism. The transmission track is located at the front end of the frame containing box, and the placement head is located at the rear end of the transmission track. The anti-folding frame detection mechanism includes a fixed bracket, a movable lever, a detection roller, a sensor, a controller and an alarm. When the thickness of the lead frame conveyed on the transmission track is greater than the gap between the lower end surface of the detection roller and the transmission track, the detection roller is lifted up, and the movable lever rises accordingly, and the sensor detects the upward movement of the movable lever , send a signal to the controller, and the alarm is controlled by the controller to send out an alarm. The present invention can effectively detect that two or more frames are overlapped and sent to the track, so that the equipment will stop and give an alarm, reminding the staff to deal with it, thus directly improving the welding quality, reducing the loss of raw materials, and thus reducing the production cost.

Description

technical field [0001] The invention relates to the technical field of placement machines, in particular to a placement machine with an anti-overlapping function. Background technique [0002] A placement machine, also known as a placement machine or a surface mount system, is a device that fixes a chip to a lead frame. The placement machine is mainly composed of a frame housing box, a conveying track and a placement head. The lead frames are stacked and stored in a frame container. During production, the frame housing box allows the lead frames inside it to drop onto the conveying track one by one, and the lead frame is conveyed to the bottom of the placement head by the conveying track, and the chip is accurately placed on the lead frame by moving the placement head The patch part is patched. As the chip carrier of integrated circuits, the lead frame is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal circuit ...

AI Technical Summary

Problems solved by technology

[0003] What the present invention aims to solve is that the existing chip mounter is prone to overlapping lead frames, resulting in unqualified products and waste of raw materials, and provides a chip mounter with an anti-stacking function

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